Issued Patents All Time
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10784181 | Apparatus and manufacturing method | HuiLi Fu, Shujie Cai | 2020-09-22 |
| 10490506 | Packaged chip and signal transmission method based on packaged chip | Chih Chiang Ma, Xiaodong Zhang | 2019-11-26 |
| 10475741 | Chip | HuiLi Fu, Xiaodong Zhang, Zhiqiang Ma | 2019-11-12 |
| 9601474 | Electrically stackable semiconductor wafer and chip packages | Shou-Lung Chen, Ching-Wen Hsaio, Yu-Hua Chen, Jeng-Dar Ko, Chih-Ming Tzeng +1 more | 2017-03-21 |
| 9059181 | Wafer leveled chip packaging structure and method thereof | Shou-Lung Chen, Ching-Wen Hsaio, Yu-Hua Chen, Jeng-Dar Ko, Chih-Ming Tzeng +1 more | 2015-06-16 |
| 8587091 | Wafer-leveled chip packaging structure and method thereof | Shou-Lung Chen, Ching-Wen Hsiao, Yu-Hua Chen, Jeng-Dar Ko, Chih-Ming Tzeng +1 more | 2013-11-19 |
| 8314482 | Semiconductor package device | Shou-Lung Chen, Ching-Wen Hsiao, Yu-Hua Chen, Jeng-Dar Ko, Chih-Ming Tzeng +1 more | 2012-11-20 |
| 8248803 | Semiconductor package and method of manufacturing the same | Ming Lu | 2012-08-21 |
| 7879438 | Substrate warpage-reducing structure | Bin Xie, Yeung Yeung, Xunqing Shi, Chang Hwa Chung | 2011-02-01 |
| 7838333 | Electronic device package and method of manufacturing the same | Shou-Lung Chen, Ching-Wen Hsiao, Yu-Hua Chen, Jeng-Dar Ko | 2010-11-23 |
| 7632707 | Electronic device package and method of manufacturing the same | Shou-Lung Chen, Ching-Wen Hsiao, Yu-Hua Chen, Jeng-Dar Ko | 2009-12-15 |
| 7572676 | Packaging structure and method of an image sensor module | Fang-Jun Leu, Shou-Lung Chen, Ching-Wen Hsiao, Shan-Pu Yu, I-Hsuan Peng +3 more | 2009-08-11 |
| 7528009 | Wafer-leveled chip packaging structure and method thereof | Shou-Lung Chen, Ching-Wen Hsiao, Yu-Hua Chen, Jeng-Dar Ko, Chih-Ming Tzeng +1 more | 2009-05-05 |
| 7411306 | Packaging structure and method of an image sensor module | Fang-Jun Leu, Shou-Lung Chen, Ching-Wen Hsiao, Shan-Pu Yu, I-Hsuan Peng +3 more | 2008-08-12 |
| 7294920 | Wafer-leveled chip packaging structure and method thereof | Shou-Lung Chen, Ching-Wen Hsiao, Yu-Hua Chen, Jeng-Dar Ko, Chih-Ming Tzeng +1 more | 2007-11-13 |
| 6605525 | Method for forming a wafer level package incorporating a multiplicity of elastomeric blocks and package formed | Szu-Wei Lu, Ming Lu | 2003-08-12 |
| 6358836 | Wafer level package incorporating elastomeric pads in dummy plugs | Szu-Wei Lu, Kuo-Chuan Chen, Ruoh-Huey Wang, Hsu-Tien Hu, Hsin-Chien Huang | 2002-03-19 |
| 6277669 | Wafer level packaging method and packages formed | Ling-Chen Kung, Kuo-Chuan Chen | 2001-08-21 |