Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9601474 | Electrically stackable semiconductor wafer and chip packages | Shou-Lung Chen, Ching-Wen Hsaio, Yu-Hua Chen, Jeng-Dar Ko, Chih-Ming Tzeng +1 more | 2017-03-21 |
| 9059181 | Wafer leveled chip packaging structure and method thereof | Shou-Lung Chen, Ching-Wen Hsaio, Yu-Hua Chen, Jeng-Dar Ko, Chih-Ming Tzeng +1 more | 2015-06-16 |
| 8587091 | Wafer-leveled chip packaging structure and method thereof | Shou-Lung Chen, Ching-Wen Hsiao, Yu-Hua Chen, Jeng-Dar Ko, Chih-Ming Tzeng +1 more | 2013-11-19 |
| 8314482 | Semiconductor package device | Shou-Lung Chen, Ching-Wen Hsiao, Yu-Hua Chen, Jeng-Dar Ko, Chih-Ming Tzeng +1 more | 2012-11-20 |
| 7754599 | Structure for reducing stress for vias and fabricating method thereof | Yung-Yu Hsu, Rong-Chang Feng, Ra-Min Tain, Shyi-Ching Liau, Ji-Cheng Lin +2 more | 2010-07-13 |
| 7572676 | Packaging structure and method of an image sensor module | Fang-Jun Leu, Shou-Lung Chen, Ching-Wen Hsiao, Jyh-Rong Lin, I-Hsuan Peng +3 more | 2009-08-11 |
| 7544529 | Image sensor packaging structure and method of manufacturing the same | Shou-Lung Chen, Fang-Jun Leu | 2009-06-09 |
| 7545039 | Structure for reducing stress for vias and fabricating method thereof | Yung-Yu Hsu, Rong-Chang Feng, Ra-Min Tain, Shyi-Ching Liau, Ji-Cheng Lin +2 more | 2009-06-09 |
| 7528009 | Wafer-leveled chip packaging structure and method thereof | Shou-Lung Chen, Ching-Wen Hsiao, Yu-Hua Chen, Jeng-Dar Ko, Chih-Ming Tzeng +1 more | 2009-05-05 |
| 7417293 | Image sensor packaging structure | Shou-Lung Chen, Fang-Jun Leu | 2008-08-26 |
| 7411306 | Packaging structure and method of an image sensor module | Fang-Jun Leu, Shou-Lung Chen, Ching-Wen Hsiao, Jyh-Rong Lin, I-Hsuan Peng +3 more | 2008-08-12 |
| 7294920 | Wafer-leveled chip packaging structure and method thereof | Shou-Lung Chen, Ching-Wen Hsiao, Yu-Hua Chen, Jeng-Dar Ko, Chih-Ming Tzeng +1 more | 2007-11-13 |
| 7091592 | Stacked package for electronic elements and packaging method thereof | Shou-Lung Chen, Fang-Jun Leu, I-Hsuan Peng | 2006-08-15 |