Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9601474 | Electrically stackable semiconductor wafer and chip packages | Shou-Lung Chen, Yu-Hua Chen, Jeng-Dar Ko, Chih-Ming Tzeng, Jyh-Rong Lin +1 more | 2017-03-21 |
| 9059181 | Wafer leveled chip packaging structure and method thereof | Shou-Lung Chen, Yu-Hua Chen, Jeng-Dar Ko, Chih-Ming Tzeng, Jyh-Rong Lin +1 more | 2015-06-16 |