Issued Patents All Time
Showing 1–25 of 38 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12027644 | Semiconductor device | Tzu-Chieh Hsu, Yi-Wen Huang, Hsin-Kang CHEN | 2024-07-02 |
| 11901694 | Package structure | Hsiu-Ju YANG, Hsin-Chan CHUNG | 2024-02-13 |
| 11699774 | Semiconductor device | Tzu-Chieh Hsu, Yi-Wen Huang, Hsin-Kang CHEN | 2023-07-11 |
| 11532921 | Laser device | Hsin-Chan CHUNG | 2022-12-20 |
| 11271365 | Laser element | Hsin-Chan CHUNG | 2022-03-08 |
| 11024768 | Semiconductor device | Tzu-Chieh Hsu, Yi-Wen Huang, Hsin-Kang CHEN | 2021-06-01 |
| 10756960 | Light-emitting device | Chih-Chiang Lu, Yi-Chieh Lin, Wen-Luh Liao, Chien-Fu Huang | 2020-08-25 |
| 10535799 | Semiconductor device | Tzu-Chieh Hsu, Yi-Wen Huang, Hsin-Kang CHEN | 2020-01-14 |
| 10340431 | Light-emitting device with metal bump | Jai-Tai Kuo, Min-Hsun Hsieh, Lung-Kuan Lai, Wei-Kang Cheng, Chien-Liang Liu +3 more | 2019-07-02 |
| 10236411 | Light-emitting device | Chih-Chiang Lu, Yi-Chieh Lin, Wen-Luh Liao, Chien-Fu Huang | 2019-03-19 |
| 9876153 | Light-emitting device | Jai-Tai Kuo, Min-Hsun Hsieh, Lung-Kuan Lai, Wei-Kang Cheng, Chien-Liang Liu +3 more | 2018-01-23 |
| 9601474 | Electrically stackable semiconductor wafer and chip packages | Ching-Wen Hsaio, Yu-Hua Chen, Jeng-Dar Ko, Chih-Ming Tzeng, Jyh-Rong Lin +1 more | 2017-03-21 |
| 9508891 | Method for making light-emitting device | Chih-Chiang Lu, Yi-Chieh Lin, Wen-Luh Liao, Chien-Fu Huang | 2016-11-29 |
| 9059181 | Wafer leveled chip packaging structure and method thereof | Ching-Wen Hsaio, Yu-Hua Chen, Jeng-Dar Ko, Chih-Ming Tzeng, Jyh-Rong Lin +1 more | 2015-06-16 |
| 8587091 | Wafer-leveled chip packaging structure and method thereof | Ching-Wen Hsiao, Yu-Hua Chen, Jeng-Dar Ko, Chih-Ming Tzeng, Jyh-Rong Lin +1 more | 2013-11-19 |
| 8427443 | Coordinate locating method, coordinate locating device, and display apparatus comprising the coordinate locating device | Yaojun Feng, Xiuling Zhu, Kwan Wah Ng | 2013-04-23 |
| 8314482 | Semiconductor package device | Ching-Wen Hsiao, Yu-Hua Chen, Jeng-Dar Ko, Chih-Ming Tzeng, Jyh-Rong Lin +1 more | 2012-11-20 |
| 8061857 | LED light shaping device and illumination system | Ying Liu | 2011-11-22 |
| 8048716 | Structure of embedded active components and manufacturing method thereof | Cheng-Ta Ko | 2011-11-01 |
| 8044899 | Methods and apparatus for backlight calibration | Pak Hong Ng, Chen-Jung Tsai | 2011-10-25 |
| 7838333 | Electronic device package and method of manufacturing the same | Ching-Wen Hsiao, Yu-Hua Chen, Jeng-Dar Ko, Jyh-Rong Lin | 2010-11-23 |
| 7766533 | Illumination module, and a display and general lighting apparatus using the same | Ying Liu, Pak Hong Ng | 2010-08-03 |
| 7754530 | Thermal enhanced low profile package structure and method for fabricating the same | Enboa Wu | 2010-07-13 |
| 7754599 | Structure for reducing stress for vias and fabricating method thereof | Yung-Yu Hsu, Rong-Chang Feng, Ra-Min Tain, Shyi-Ching Liau, Ji-Cheng Lin +2 more | 2010-07-13 |
| 7732928 | Structure for protecting electronic packaging contacts from stress | Shyh-Ming Chang, Ji-Cheng Lin | 2010-06-08 |