Issued Patents All Time
Showing 26–38 of 38 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7703963 | Light guiding strip and double-sided planar light apparatus | Yaojun Feng, Danding Huang, Kwan Wah Ng, Ying Liu, Cheng Jung Tsai | 2010-04-27 |
| 7632707 | Electronic device package and method of manufacturing the same | Ching-Wen Hsiao, Yu-Hua Chen, Jeng-Dar Ko, Jyh-Rong Lin | 2009-12-15 |
| 7607792 | Light-emitting devices and lens therefor | Ying Liu, Danding Huang, Chen-Jung Tsai | 2009-10-27 |
| 7607790 | Backlighting apparatus and manufacturing process | Kwan Wah Ng, Ying Liu | 2009-10-27 |
| 7572676 | Packaging structure and method of an image sensor module | Fang-Jun Leu, Ching-Wen Hsiao, Shan-Pu Yu, Jyh-Rong Lin, I-Hsuan Peng +3 more | 2009-08-11 |
| 7544529 | Image sensor packaging structure and method of manufacturing the same | Fang-Jun Leu, Shan-Pu Yu | 2009-06-09 |
| 7545039 | Structure for reducing stress for vias and fabricating method thereof | Yung-Yu Hsu, Rong-Chang Feng, Ra-Min Tain, Shyi-Ching Liau, Ji-Cheng Lin +2 more | 2009-06-09 |
| 7528009 | Wafer-leveled chip packaging structure and method thereof | Ching-Wen Hsiao, Yu-Hua Chen, Jeng-Dar Ko, Chih-Ming Tzeng, Jyh-Rong Lin +1 more | 2009-05-05 |
| 7511365 | Thermal enhanced low profile package structure | Enboa Wu | 2009-03-31 |
| 7417293 | Image sensor packaging structure | Fang-Jun Leu, Shan-Pu Yu | 2008-08-26 |
| 7411306 | Packaging structure and method of an image sensor module | Fang-Jun Leu, Ching-Wen Hsiao, Shan-Pu Yu, Jyh-Rong Lin, I-Hsuan Peng +3 more | 2008-08-12 |
| 7294920 | Wafer-leveled chip packaging structure and method thereof | Ching-Wen Hsiao, Yu-Hua Chen, Jeng-Dar Ko, Chih-Ming Tzeng, Jyh-Rong Lin +1 more | 2007-11-13 |
| 7091592 | Stacked package for electronic elements and packaging method thereof | Fang-Jun Leu, I-Hsuan Peng, Shan-Pu Yu | 2006-08-15 |