Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8026603 | Interconnect structure of an integrated circuit and manufacturing method thereof | Yung-Yu Hsu, Chih-Yuan Cheng, Shyi-Ching Liau, Min-Lin Lee, Ra-Min Tain | 2011-09-27 |
| 7754599 | Structure for reducing stress for vias and fabricating method thereof | Yung-Yu Hsu, Ra-Min Tain, Shyi-Ching Liau, Ji-Cheng Lin, Shan-Pu Yu +2 more | 2010-07-13 |
| 7545039 | Structure for reducing stress for vias and fabricating method thereof | Yung-Yu Hsu, Ra-Min Tain, Shyi-Ching Liau, Ji-Cheng Lin, Shan-Pu Yu +2 more | 2009-06-09 |
| 7004642 | Opto-electrical module packaging | Wen Yan Chen, Chun-Kai Liu | 2006-02-28 |