Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10950557 | Stacked chip package structure and manufacturing method thereof | Li-Chih Fang, Che-Min Chu, Chun-Te Lin, Chien-Wen Huang | 2021-03-16 |
| 10607860 | Package structure and chip structure | Chia-Wei Chiang, Li-Chih Fang, Che-Min Chu, Chun-Te Lin | 2020-03-31 |
| 10276510 | Manufacturing method of package structure having conductive shield | Chia-Wei Chiang, Li-Chih Fang, Che-Min Chu, Chun-Te Lin | 2019-04-30 |
| 9825010 | Stacked chip package structure and manufacturing method thereof | Li-Chih Fang, Che-Min Chu, Chun-Te Lin, Chien-Wen Huang | 2017-11-21 |
| 7754599 | Structure for reducing stress for vias and fabricating method thereof | Yung-Yu Hsu, Rong-Chang Feng, Ra-Min Tain, Shyi-Ching Liau, Shan-Pu Yu +2 more | 2010-07-13 |
| 7732928 | Structure for protecting electronic packaging contacts from stress | Shyh-Ming Chang, Shou-Lung Chen | 2010-06-08 |
| 7691676 | Mold array process for semiconductor packages | Wen-Jeng Fan, Li-Chih Fang | 2010-04-06 |
| 7545039 | Structure for reducing stress for vias and fabricating method thereof | Yung-Yu Hsu, Rong-Chang Feng, Ra-Min Tain, Shyi-Ching Liau, Shan-Pu Yu +2 more | 2009-06-09 |
| 7531900 | Package structure for electronic device | Shyh-Ming Chang | 2009-05-12 |
| 7378746 | Composite bump | Yao-Sheng Lin, Shyh-Ming Chang, Su-Tsai Lu, Hsien-Chie Cheng, Tai-Hong Chen | 2008-05-27 |
| 6541834 | Silicon pressure micro-sensing device and the fabrication process | Jin-Shown Shie, Chun-Te Lin, Chih-Tang Peng, Shih-han Yu, Kuo-Ning Chiang | 2003-04-01 |