Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12328907 | Semiconductor device and manufacturing method thereof | Yang-Shun Fan, Chen-Shuo Huang | 2025-06-10 |
| 10607860 | Package structure and chip structure | Li-Chih Fang, Ji-Cheng Lin, Che-Min Chu, Chun-Te Lin | 2020-03-31 |
| 10593629 | Semiconductor package with a conductive casing for heat dissipation and electromagnetic interference (EMI) shield and manufacturing method thereof | Li-Chih Fang, Wen-Jeng Fan | 2020-03-17 |
| 10431549 | Semiconductor package and manufacturing method thereof | Chien-Wen Huang, Wen-Jeng Fan, Li-Chih Fang | 2019-10-01 |
| 10276510 | Manufacturing method of package structure having conductive shield | Li-Chih Fang, Ji-Cheng Lin, Che-Min Chu, Chun-Te Lin | 2019-04-30 |