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USPTO Patent Rankings Data through Dec 31, 2025
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Che-Min Chu — 10 Patents

PTPowertech Technology: 6 patents #12 of 136Top 9%
TSMC: 3 patents #5,465 of 12,232Top 45%
Taichung, TW: #790 of 7,415 inventorsTop 15%
Overall (All Time): #481,000 of 4,157,543Top 15%
10 Patents All Time
Che-Min Chu has been granted 10 US patents while listed as an inventor at Powertech Technology. The first was granted in 2012 and the most recent in March 2021. Che-Min Chu ranks #481,000 of 4,157,543 US inventors in our database (top 11.6%). Patent records list Che-Min Chu in Taichung, TW.

Issued Patents All Time

Showing 1–10 of 10 patents

Patent #TitleCo-InventorsDateApprox Value ⓘ
10950557 Stacked chip package structure and manufacturing method thereof Li-Chih Fang, Ji-Cheng Lin, Chun-Te Lin, Chien-Wen Huang 2021-03-16
10607860 Package structure and chip structure Chia-Wei Chiang, Li-Chih Fang, Ji-Cheng Lin, Chun-Te Lin 2020-03-31
10276510 Manufacturing method of package structure having conductive shield Chia-Wei Chiang, Li-Chih Fang, Ji-Cheng Lin, Chun-Te Lin 2019-04-30
10276575 Multi-threshold voltage field effect transistor and manufacturing method thereof Amey Mahadev Walke, Chi-Hsun Hsieh, Yu-Hsuan Kuo 2019-04-30 $1,428,000
9837416 Multi-threshold voltage field effect transistor and manufacturing method thereof Amey Mahadev Walke, Chi-Hsun Hsieh, Yu-Hsuan Kuo 2017-12-05 $3,148,000
9825010 Stacked chip package structure and manufacturing method thereof Li-Chih Fang, Ji-Cheng Lin, Chun-Te Lin, Chien-Wen Huang 2017-11-21
D775896 Cup 2017-01-10
8853834 Leadframe-type semiconductor package having EMI shielding layer connected to ground Wen-Jeng Fan, Ming-Yen Wu 2014-10-07
8541870 Semiconductor package utilizing tape to reinforce fixing of leads to die pad Wen-Jeng Fan, Wei-Min Chen 2013-09-24
8278179 LDD epitaxy for FinFETs Da-Wen Lin, Tsung-Hung Li, Chih-Hung Tseng, Yen-Chun Lin, Chung-Cheng Wu 2012-10-02 $4,291,000