Issued Patents All Time
Showing 25 most recent of 42 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11386152 | Automatic generation of highlight clips for events | Rahamim Rami Arowesty, Kevin Chu, Lijia Yang | 2022-07-12 |
| 11257747 | Semiconductor package with conductive via in encapsulation connecting to conductive element | Shang-Yu Chang Chien, Nan-Chun Lin, Hung-Hsin Hsu | 2022-02-22 |
| 10593629 | Semiconductor package with a conductive casing for heat dissipation and electromagnetic interference (EMI) shield and manufacturing method thereof | Chia-Wei Chiang, Li-Chih Fang | 2020-03-17 |
| 10431549 | Semiconductor package and manufacturing method thereof | Chien-Wen Huang, Chia-Wei Chiang, Li-Chih Fang | 2019-10-01 |
| 9991248 | Method and device of pop stacking for preventing bridging of interposer solder balls | — | 2018-06-05 |
| 9859233 | Semiconductor device package with reinforced redistribution layer | — | 2018-01-02 |
| 9853015 | Semiconductor device with stacking chips | — | 2017-12-26 |
| 9837385 | Substrate-less package structure | — | 2017-12-05 |
| 9324651 | Package structure | — | 2016-04-26 |
| 8853834 | Leadframe-type semiconductor package having EMI shielding layer connected to ground | Che-Min Chu, Ming-Yen Wu | 2014-10-07 |
| 8541870 | Semiconductor package utilizing tape to reinforce fixing of leads to die pad | Che-Min Chu, Wei-Min Chen | 2013-09-24 |
| 8420437 | Method for forming an EMI shielding layer on all surfaces of a semiconductor package | — | 2013-04-16 |
| 8304917 | Multi-chip stacked package and its mother chip to save interposer | Li-Chih Fang, Ronald Takaoiwata | 2012-11-06 |
| 8299587 | Lead frame package structure for side-by-side disposed chips | — | 2012-10-30 |
| 8240029 | Method for forming an isolated inner lead from a leadframe | Yu-Mei Hsu | 2012-08-14 |
| 8053676 | Substrate panel having a plurality of substrate strips for semiconductor packages | — | 2011-11-08 |
| 8049339 | Semiconductor package having isolated inner lead | Yu-Mei Hsu | 2011-11-01 |
| 7972904 | Wafer level packaging method | — | 2011-07-05 |
| 7952168 | Substrate strip for semiconductor packages | — | 2011-05-31 |
| 7927919 | Semiconductor packaging method to save interposer | Li-Chih Fang, Ronald Takao Iwata | 2011-04-19 |
| 7919851 | Laminate substrate and semiconductor package utilizing the substrate | — | 2011-04-05 |
| 7919715 | Circuit board ready to slot | — | 2011-04-05 |
| 7902663 | Semiconductor package having stepwise depression in substrate | — | 2011-03-08 |
| 7821112 | Semiconductor device with wire-bonding on multi-zigzag fingers | Yu-Mei Hsu | 2010-10-26 |
| 7776649 | Method for fabricating wafer level chip scale packages | — | 2010-08-17 |