| 9126140 |
Collecting device for gases and aerosol, methods of making, and method of use |
Chang-Yu Wu, Alex Theodore, Lin Shou, Danielle Lyon Hall |
2015-09-08 |
| 9084958 |
Collecting device for gases and aerosol, methods of making, and methods of use |
Chang-Yu Wu, Alex Theodore, Lin Shou, Danielle Lyon Hall |
2015-07-21 |
| 8240029 |
Method for forming an isolated inner lead from a leadframe |
Wen-Jeng Fan |
2012-08-14 |
| 8049339 |
Semiconductor package having isolated inner lead |
Wen-Jeng Fan |
2011-11-01 |
| 7821112 |
Semiconductor device with wire-bonding on multi-zigzag fingers |
Wen-Jeng Fan |
2010-10-26 |
| 7812430 |
Leadframe and semiconductor package having downset baffle paddles |
Chin-Fa Wang, Wan-Jung Hsieh |
2010-10-12 |
| 7750444 |
Lead-on-chip semiconductor package and leadframe for the package |
Wen-Jeng Fan |
2010-07-06 |
| 7723828 |
Semiconductor package with leads on a chip having multi-row of bonding pads |
Wen-Jeng Fan |
2010-05-25 |
| 7619307 |
Leadframe-based semiconductor package having arched bend in a supporting bar and leadframe for the package |
Chin-Fa Wang, Wan-Jung Hsieh |
2009-11-17 |
| D568607 |
Tool box |
— |
2008-05-13 |
