Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Leadframe-based semiconductor package having arched bend in a supporting bar and leadframe for the package

Leadframe-based semiconductor package having arched bend in a supporting bar and leadframe for the package

US Patent 7619307 · Granted Nov 17, 2009

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Collecting device for gases and aerosol, methods of making, and method of use2015
Collecting device for gases and aerosol, methods of making, and methods of use2015
Method for forming an isolated inner lead from a leadframe2012
COL package having small chip hidden between leads2012
Semiconductor package having isolated inner lead2011
Inner-connecting structure of lead frame and its connecting method2011
Semiconductor package having substrate ID code and its fabricating method2011
Semiconductor device with wire-bonding on multi-zigzag fingers2010
Leadframe and semiconductor package having downset baffle paddles2010
Leadframe and semiconductor package having downset baffle paddles2010
Leadframe and semiconductor package having downset baffle paddles2010
Lead-on-chip semiconductor package and leadframe for the package2010