Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8125063 | COL package having small chip hidden between leads | — | 2012-02-28 |
| 8040690 | Inner-connecting structure of lead frame and its connecting method | — | 2011-10-18 |
| 7884472 | Semiconductor package having substrate ID code and its fabricating method | Chin-Ti Chen, Ching-Wei Hung, Bing YU | 2011-02-08 |
| 7812430 | Leadframe and semiconductor package having downset baffle paddles | Wan-Jung Hsieh, Yu-Mei Hsu | 2010-10-12 |
| 7619307 | Leadframe-based semiconductor package having arched bend in a supporting bar and leadframe for the package | Wan-Jung Hsieh, Yu-Mei Hsu | 2009-11-17 |
| 7564123 | Semiconductor package with fastened leads | Chin-Ti Chen, Bing YU, Wan-Jung Hsieh | 2009-07-21 |
| 7549568 | Method of forming identification code for wire-bonding machines | Chin-Ti Chen, Bing YU | 2009-06-23 |
| 7279439 | Rug structure | — | 2007-10-09 |
| 6903441 | Semiconductor package with enhanced chip groundability and method of fabricating the same | Wen-Ta Tsai, Yuan-Ping Joe | 2005-06-07 |