Chin-Fa Wang — 9 Patents at Powertech Technology

Chin-Fa Wang has been granted 9 US patents while listed as an inventor at Powertech Technology. The first was granted in 2005 and the most recent in February 2012. Chin-Fa Wang ranks #535,341 of 4,157,543 US inventors in our database (top 12.9%). Patent records list Chin-Fa Wang in 溪州鄉, TW.

Issued Patents All Time

Showing 1–9 of 9 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
8125063	COL package having small chip hidden between leads	—	2012-02-28
8040690	Inner-connecting structure of lead frame and its connecting method	—	2011-10-18
7884472	Semiconductor package having substrate ID code and its fabricating method	Chin-Ti Chen, Ching-Wei Hung, Bing YU	2011-02-08
7812430	Leadframe and semiconductor package having downset baffle paddles	Wan-Jung Hsieh, Yu-Mei Hsu	2010-10-12
7619307	Leadframe-based semiconductor package having arched bend in a supporting bar and leadframe for the package	Wan-Jung Hsieh, Yu-Mei Hsu	2009-11-17
7564123	Semiconductor package with fastened leads	Chin-Ti Chen, Bing YU, Wan-Jung Hsieh	2009-07-21
7549568	Method of forming identification code for wire-bonding machines	Chin-Ti Chen, Bing YU	2009-06-23
7279439	Rug structure	—	2007-10-09
6903441	Semiconductor package with enhanced chip groundability and method of fabricating the same	Wen-Ta Tsai, Yuan-Ping Joe	2005-06-07	$1,301,000

Chin-Fa Wang — 9 Patents

Issued Patents All Time

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