Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor package with enhanced chip groundability and method of fabricating the same

Semiconductor package with enhanced chip groundability and method of fabricating the same

US Patent 6903441 · Granted Jun 7, 2005

Estimated economic value: $1,301,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Voltage converter with reduced inductive energy conversion2025
COL package having small chip hidden between leads2012
Inner-connecting structure of lead frame and its connecting method2011
Semiconductor package having substrate ID code and its fabricating method2011
Leadframe and semiconductor package having downset baffle paddles2010
Leadframe-based semiconductor package having arched bend in a supporting bar and2009
Semiconductor package with fastened leads2009
Method of forming identification code for wire-bonding machines2009
Chair2008
Chair2007
Rug structure2007
Armrest2007