Issued Patents All Time
Showing 1–23 of 23 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| D569116 | Chair | — | 2008-05-20 |
| D554877 | Chair | — | 2007-11-13 |
| D538075 | Armrest | — | 2007-03-13 |
| D537282 | Armrest | — | 2007-02-27 |
| D537283 | Armrest | — | 2007-02-27 |
| D516828 | Chair | — | 2006-03-14 |
| D514831 | Chair | — | 2006-02-14 |
| D514832 | Chair | — | 2006-02-14 |
| D512574 | Chair | — | 2005-12-13 |
| 6903441 | Semiconductor package with enhanced chip groundability and method of fabricating the same | Chin-Fa Wang, Yuan-Ping Joe | 2005-06-07 |
| D500607 | Chair | — | 2005-01-11 |
| 6777266 | Dual-chip integrated circuit package and method of manufacturing the same | Chieh-Ping Huang, Lian-Cherng Chiang | 2004-08-17 |
| 6608388 | Delamination-preventing substrate and semiconductor package with the same | Yuan-Fu Lin | 2003-08-19 |
| 6590279 | Dual-chip integrated circuit package and method of manufacturing the same | Chieh-Ping Huang, Lian-Cherng Chiang | 2003-07-08 |
| D476495 | Chair | — | 2003-07-01 |
| D475210 | Chair | — | 2003-06-03 |
| D470322 | Chair | — | 2003-02-18 |
| D468140 | Chair armrest | — | 2003-01-07 |
| 6428849 | Method for the co-deposition of silicon and nitrogen on stainless steel surface | Hung-Wen Hsu | 2002-08-06 |
| 6307257 | Dual-chip integrated circuit package with a chip-die pad formed from leadframe leads | Chien-Ping Huang, Lian-Cherng Chiang | 2001-10-23 |
| 6264535 | Wafer sawing/grinding process | Shi-Yu Chang, Chin-Te Chen | 2001-07-24 |
| 5496593 | Process for producing a nitrogen-alloyed stainless steel layer on steel | CHONG-CHENG HUANG, Ju-Tung Lee | 1996-03-05 |
| 5411770 | Method of surface modification of stainless steel | Ju-Tung Lee, Tai-Hwang Lai | 1995-05-02 |