Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8159063 | Substrate and package with micro BGA configuration | — | 2012-04-17 |
| 7884472 | Semiconductor package having substrate ID code and its fabricating method | Chin-Ti Chen, Bing YU, Chin-Fa Wang | 2011-02-08 |