Issued Patents All Time
Showing 1–25 of 43 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12400979 | Integrated antenna package structure and manufacturing method thereof | Nan-Chun Lin, Hung-Hsin Hsu | 2025-08-26 |
| 12154863 | Fan-out semiconductor package and method for manufacturing the same | Nan-Chun Lin, Hung-Hsin Hsu | 2024-11-26 |
| 11990494 | Package structure and manufacturing method thereof | Hung-Hsin Hsu | 2024-05-21 |
| 11973037 | Package structure and manufacturing method thereof | Nan-Chun Lin, Hung-Hsin Hsu | 2024-04-30 |
| 11916035 | Package structure and manufacturing method thereof | Nan-Chun Lin, Hung-Hsin Hsu | 2024-02-27 |
| 11769763 | Package structure and manufacturing method thereof | Nan-Chun Lin, Hung-Hsin Hsu | 2023-09-26 |
| 11637071 | Package structure including multiple dies surrounded by conductive element and manufacturing method thereof | Nan-Chun Lin, Hung-Hsin Hsu | 2023-04-25 |
| 11569210 | Package structure having a first connection circuit and manufacturing method thereof | Nan-Chun Lin, Hung-Hsin Hsu | 2023-01-31 |
| 11545424 | Package structure and manufacturing method thereof | Nan-Chun Lin, Hung-Hsin Hsu | 2023-01-03 |
| 11545423 | Package structure and manufacturing method thereof | Nan-Chun Lin, Hung-Hsin Hsu | 2023-01-03 |
| 11532575 | Integrated antenna package structure and manufacturing method thereof | Han-Wen Lin, Hung-Hsin Hsu, Nan-Chun Lin | 2022-12-20 |
| 11456243 | Semiconductor package structure and manufacturing method thereof | Nan-Chun Lin, Hung-Hsin Hsu | 2022-09-27 |
| 11367678 | Package structure and manufacturing method thereof | Hung-Hsin Hsu, Chia-Yu Hung, Nan-Chun Lin | 2022-06-21 |
| 11309296 | Semiconductor package and manufacturing method thereof | Nan-Chun Lin, Hung-Hsin Hsu, Wen-Hsiung Chang | 2022-04-19 |
| 11309283 | Packaging structure and manufacturing method thereof | Nan-Chun Lin, Hung-Hsin Hsu | 2022-04-19 |
| 11296041 | Integrated antenna package structure and manufacturing method thereof | Hung-Hsin Hsu, Nan-Chun Lin | 2022-04-05 |
| 11257747 | Semiconductor package with conductive via in encapsulation connecting to conductive element | Wen-Jeng Fan, Nan-Chun Lin, Hung-Hsin Hsu | 2022-02-22 |
| 11251170 | Package structure and manufacturing method thereof | Hung-Hsin Hsu, Nan-Chun Lin | 2022-02-15 |
| 11211350 | Semiconductor package and manufacturing method thereof | Hung-Hsin Hsu, Nan-Chun Lin | 2021-12-28 |
| 11211321 | Package structure and manufacturing method thereof | Nan-Chun Lin, Hung-Hsin Hsu | 2021-12-28 |
| 11171106 | Semiconductor package structure with circuit substrate and manufacturing method thereof | Nan-Chun Lin, Hung-Hsin Hsu | 2021-11-09 |
| 11127699 | Chip package structure and manufacturing method thereof | Nan-Chun Lin, Hung-Hsin Hsu | 2021-09-21 |
| 11094654 | Package structure and method of manufacturing the same | Nan-Chun Lin, Hung-Hsin Hsu | 2021-08-17 |
| 11088080 | Chip package structure using silicon interposer as interconnection bridge | Pei-Chun Tsai, Hung-Hsin Hsu, Nan-Chun Lin | 2021-08-10 |
| 11088100 | Semiconductor package and manufacturing method thereof | Hung-Hsin Hsu, Nan-Chun Lin | 2021-08-10 |