Issued Patents All Time
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11506965 | Illumination system and projection device | — | 2022-11-22 |
| 11088080 | Chip package structure using silicon interposer as interconnection bridge | Hung-Hsin Hsu, Shang-Yu Chang Chien, Nan-Chun Lin | 2021-08-10 |
| 10978362 | Semiconductor structure with conductive structure | Wei Sen Chang, Tin-Hao Kuo, Hao-Yi Tsai | 2021-04-13 |
| 10978363 | Semiconductor structure with conductive structure | Wei Sen Chang, Tin-Hao Kuo, Hao-Yi Tsai | 2021-04-13 |
| 10877573 | Handheld apparatus, control method thereof of presenting mode and computer-readable recording medium | Shuo-Fang Jeng, Yu-Cheng Hung, Shih-Lung Lin, Kuan-Wei Li, Yu-Chu Lin +1 more | 2020-12-29 |
| D905074 | Display screen or portion thereof with graphical user interface | Wei Lin, Ching-Tzu Hung, I-Chen Chen, Sheng-Hsin Huang | 2020-12-15 |
| 10838541 | Method for operating handheld device, handheld device and computer-readable recording medium thereof | Yu-Cheng Hung, Shih-Lung Lin | 2020-11-17 |
| 10768717 | Method for operating handheld device, handheld device and computer-readable recording medium thereof | Yu-Cheng Hung, Shuo-Fang Jeng, Shih-Lung Lin, Kuan-Wei Li, Sheng-Chieh Lin | 2020-09-08 |
| 10733706 | Mobile device, and image processing method for mobile device | Kuan-Wei Li, Ching Wen Fu | 2020-08-04 |
| 10490468 | Semiconductor structure with conductive structure | Wei Sen Chang, Tin-Hao Kuo, Hao-Yi Tsai | 2019-11-26 |
| 10277186 | Calibration method and computer readable recording medium | Kuo-Feng Liao, Wei-Po Lin | 2019-04-30 |
| 10157874 | Contact area design for solder bonding | Yu-Feng Chen, Tin-Hao Kuo, Chen-Shien Chen, Yu-Chih Huang, Sheng-Yu Wu | 2018-12-18 |
| 10008459 | Structures having a tapering curved profile and methods of making same | Yu-Jen Tseng, Tin-Hao Kuo, Chen-Shien Chen | 2018-06-26 |
| 9935024 | Method for forming semiconductor structure | Wei Sen Chang, Tin-Hao Kuo, Hao-Yi Tsai | 2018-04-03 |
| 9871013 | Contact area design for solder bonding | Yu-Feng Chen, Tin-Hao Kuo, Chen-Shien Chen, Yu-Chih Huang, Sheng-Yu Wu | 2018-01-16 |
| 9449941 | Connecting function chips to a package to form package-on-package | Sheng-Yu Wu, Ching-Wen Hsiao, Tin-Hao Kuo, Chen-Shien Chen, Chung-Shi Liu +2 more | 2016-09-20 |
| 9006909 | Solder mask shape for BOT laminate packages | Chih-Horng Chang, Sheng-Yu Wu, Tin-Hao Kuo, Chen-Shien Chen | 2015-04-14 |
| 8823170 | Apparatus and method for three dimensional integrated circuits | Sheng-Yu Wu, Chih-Horng Chang, Tin-Hao Kuo, Chen-Shien Chen | 2014-09-02 |
| 8747696 | Phosphors and white light illumination devices utilizing the same | Jen-Chun Lin, Su-Ren Wang, Kuo-Ju Chen, Chun Che Lin, Ru-Shi Liu | 2014-06-10 |
| 8623756 | Reflow system and method for conductive connections | Chita Chuang, Sheng-Yu Wu, Tin-Hao Kuo, Ming-Da Cheng, Chen-Shien Chen | 2014-01-07 |