Issued Patents All Time
Showing 1–25 of 80 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431446 | Package structure | Chih-Hsuan Tai, Ting-Ting Kuo, Chih-Wei Lin, Hsiu-Jen Lin, Chih-Hua Chen +4 more | 2025-09-30 |
| 12399438 | Method and apparatus for removing contamination | Yu-Kai Chiou, Chieh-Jen Cheng, Li-Jui Chen | 2025-08-26 |
| 12394242 | Fingerprint sensor device and method | Chih-Hua Chen, Yu-Jen Cheng, Chih-Wei Lin, Yu-Feng Chen, Hao-Yi Tsai +2 more | 2025-08-19 |
| 12381163 | Semiconductor package and manufacturing method thereof | Chih-Hao Chang, Po-Chun Lin, Chun-Ti Lu, Zheng-Gang Tsai, Shih-Wei Chen +3 more | 2025-08-05 |
| 12362274 | Package structure and method of forming the same | Chih-Hsuan Tai, Hao-Yi Tsai, Tsung-Hsien Chiang, Chia-Hung Liu, Ban-Li Wu +2 more | 2025-07-15 |
| 12334956 | Data processing system and data processing method for deep neural network model | Li-Yang Tseng | 2025-06-17 |
| 12334434 | Package structure and method of forming the same | Chih-Hsuan Tai, Hao-Yi Tsai, Tsung-Hsien Chiang, Chia-Hung Liu, Ban-Li Wu +2 more | 2025-06-17 |
| 12300644 | Die bonding pads and methods of forming the same | Wen-Hsiung Lu, Ming-Da Cheng, Chia-Li Lin, Chen-Shien Chen | 2025-05-13 |
| 12287589 | Method and apparatus for removing contamination | Yu-Kai Chiou, Chieh-Jen Cheng, Li-Jui Chen | 2025-04-29 |
| 12260669 | Fingerprint sensor in InFO structure and formation method | Chih-Hua Chen, Yu-Feng Chen, Chung-Shi Liu, Chen-Hua Yu, Hao-Yi Tsai | 2025-03-25 |
| 12205860 | Sensor packages | Tsung-Hsien Chiang, Ting-Ting Kuo, Chih-Hsuan Tai, Ban-Li Wu, Ying-Cheng Tseng +5 more | 2025-01-21 |
| 12113022 | Semiconductor package and manufacturing method of semiconductor package | Ying-Cheng Tseng, Hao-Yi Tsai, Chia-Hung Liu | 2024-10-08 |
| 12111582 | Substrate stage and substrate processing system using the same | Yu-Huan Chen, Ya-An PENG, Shang-Chieh Chien, Li-Jui Chen, Heng-Hsin Liu | 2024-10-08 |
| 12114411 | Apparatus and method for generating extreme ultraviolet radiation | Yu-Huan Chen, Ming-Hsun Tsai, Shang-Chieh Chien, Heng-Hsin Liu | 2024-10-08 |
| 12068212 | Package structure with through via extending through redistribution layer and method of manufacturing the same | Chih-Hsuan Tai, Chih-Hua Chen, Hao-Yi Tsai, Chia-Hung Liu, Ting-Ting Kuo | 2024-08-20 |
| 12015017 | Package structure, package-on-package structure and method of fabricating the same | Chih-Hsuan Tai, Hao-Yi Tsai, Chia-Hung Liu, Ting-Ting Kuo, Ban-Li Wu +2 more | 2024-06-18 |
| 12009322 | Package structure with through-via in molding compound and dielectric layer | Chih-Hsuan Tai, Ting-Ting Kuo, Chih-Wei Lin, Hsiu-Jen Lin, Chih-Hua Chen +4 more | 2024-06-11 |
| 12002768 | Semiconductor package and manufacturing method thereof | Chih-Hao Chang, Po-Chun Lin, Chun-Ti Lu, Zheng-Gang Tsai, Shih-Wei Chen +3 more | 2024-06-04 |
| 11929318 | Package structure and method of forming the same | Chih-Hsuan Tai, Hao-Yi Tsai, Tsung-Hsien Chiang, Chia-Hung Liu, Ban-Li Wu +2 more | 2024-03-12 |
| 11855232 | Semiconductor package and forming method thereof | Chih-Hsuan Tai, Hao-Yi Tsai, Chih-Hao Chang, Chia-Hung Liu, Ban-Li Wu +2 more | 2023-12-26 |
| 11847852 | Manufacturing method of fingerprint sensor | Chih-Hsuan Tai, Chih-Hua Chen, Hao-Yi Tsai, Chia-Hung Liu, Ting-Ting Kuo +1 more | 2023-12-19 |
| 11842993 | Semiconductor device with multiple polarity groups | Ying-Cheng Tseng, Chih-Hsuan Tai, Ting-Ting Kuo, Chi-Hui Lai, Ban-Li Wu +2 more | 2023-12-12 |
| 11830781 | Package structure and manufacturing method thereof | Wei-Yu Chen, Chih-Hua Chen, Ching-Hua Hsieh, Hsiu-Jen Lin, Yu-Peng Tsai +3 more | 2023-11-28 |
| 11830796 | Circuit substrate, package structure and method of manufacturing the same | Shih-Wei Chen, Chih-Hao Chang, Po-Chun Lin, Chun-Ti Lu, Chia-Hung Liu +1 more | 2023-11-28 |
| 11747741 | Substrate stage, substrate processing system using the same, and method for processing substrate | Yu-Huan Chen, Ya-An PENG, Shang-Chieh Chien, Li-Jui Chen, Heng-Hsin Liu | 2023-09-05 |