Issued Patents All Time
Showing 1–25 of 52 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12381163 | Semiconductor package and manufacturing method thereof | Yu-Chih Huang, Chih-Hao Chang, Po-Chun Lin, Chun-Ti Lu, Zheng-Gang Tsai +3 more | 2025-08-05 |
| 12300618 | Semiconductor device having a heat dissipation structure connected chip package | Po-Yuan Teng, Hung-Yi Kuo, Hao-Yi Tsai, Tin-Hao Kuo, Yu-Chia Lai | 2025-05-13 |
| 12255196 | Semiconductor package with thermal relaxation block and manufacturing method thereof | Chih-Hua Chen, Hsin-Yu Pan, Hao-Yi Tsai, Lipu Kris Chuang, Tin-Hao Kuo | 2025-03-18 |
| 12125804 | Semiconductor package and manufacturing method thereof | Wei-Kang Hsieh, Hao-Yi Tsai, Tin-Hao Kuo | 2024-10-22 |
| 12009735 | Synchronous rectifier controller and control method used for adjusting a voltage of a control terminal of a rectifier switch | — | 2024-06-11 |
| 12009281 | Package structure and method of manufacturing the same | Hao-Yi Tsai, Kuo Lung Pan, Tin-Hao Kuo, Po-Yuan Teng, Chi-Hui Lai | 2024-06-11 |
| 12002768 | Semiconductor package and manufacturing method thereof | Yu-Chih Huang, Chih-Hao Chang, Po-Chun Lin, Chun-Ti Lu, Zheng-Gang Tsai +3 more | 2024-06-04 |
| 11916025 | Device die and method for fabricating the same | Tzuan-Horng Liu, Chia-Hung Liu, Hao-Yi Tsai | 2024-02-27 |
| 11854986 | Chamfered die of semiconductor package and method for forming the same | Chen-Hua Yu, Wei-Kang Hsieh, Tin-Hao Kuo, Hao-Yi Tsai | 2023-12-26 |
| 11830866 | Semiconductor package with thermal relaxation block and manufacturing method thereof | Chih-Hua Chen, Hsin-Yu Pan, Hao-Yi Tsai, Lipu Kris Chuang, Tin-Hao Kuo | 2023-11-28 |
| 11830796 | Circuit substrate, package structure and method of manufacturing the same | Yu-Chih Huang, Chih-Hao Chang, Po-Chun Lin, Chun-Ti Lu, Chia-Hung Liu +1 more | 2023-11-28 |
| 11824017 | Semiconductor package and manufacturing method thereof | Wei-Kang Hsieh, Hao-Yi Tsai, Tin-Hao Kuo | 2023-11-21 |
| 11749640 | Semiconductor package and method of manufacturing the same | Chih-Hua Chen, Hsin-Yu Pan, Hao-Yi Tsai, Lipu Kris Chuang, Tin-Hao Kuo | 2023-09-05 |
| 11694943 | Semiconductor device including heat dissipation structure and fabricating method of the same | Po-Yuan Teng, Chen-Hua Yu, Hao-Yi Tsai, Kuo-Chung Yee, Tin-Hao Kuo | 2023-07-04 |
| 11682626 | Chamfered die of semiconductor package and method for forming the same | Chen-Hua Yu, Wei-Kang Hsieh, Tin-Hao Kuo, Hao-Yi Tsai | 2023-06-20 |
| 11540761 | Systems and methods for facilitating exercise monitoring with real-time heart rate monitoring and motion analysis | Ching-Lin Hsieh | 2023-01-03 |
| 11515268 | Semiconductor package and manufacturing method thereof | Wei-Kang Hsieh, Hao-Yi Tsai, Tin-Hao Kuo | 2022-11-29 |
| 11309302 | Manufacturing method of semiconductor package including thermal conductive block | Chih-Hua Chen, Hsin-Yu Pan, Hao-Yi Tsai, Lipu Kris Chuang, Tin-Hao Kuo | 2022-04-19 |
| 11282791 | Semiconductor device having a heat dissipation structure connected chip package | Po-Yuan Teng, Hung-Yi Kuo, Hao-Yi Tsai, Tin-Hao Kuo, Yu-Chia Lai | 2022-03-22 |
| 11239135 | Package structure and method of manufacturing the same | Hao-Yi Tsai, Kuo Lung Pan, Tin-Hao Kuo, Po-Yuan Teng, Chi-Hui Lai | 2022-02-01 |
| 11205636 | Semiconductor package and method of manufacturing the same | Chih-Hua Chen, Hsin-Yu Pan, Hao-Yi Tsai, Lipu Kris Chuang, Tin-Hao Kuo | 2021-12-21 |
| 11177192 | Semiconductor device including heat dissipation structure and fabricating method of the same | Po-Yuan Teng, Chen-Hua Yu, Hao-Yi Tsai, Kuo-Chung Yee, Tin-Hao Kuo | 2021-11-16 |
| 11032932 | Mount assembly for expansion card and circuit assembly | — | 2021-06-08 |
| 10811384 | Semiconductor package and method of manufacturing the same | Chih-Hua Chen, Hsin-Yu Pan, Hao-Yi Tsai, Lipu Kris Chuang, Tin-Hao Kuo | 2020-10-20 |
| 10720416 | Semiconductor package including thermal relaxation block and manufacturing method thereof | Chih-Hua Chen, Hsin-Yu Pan, Hao-Yi Tsai, Lipu Kris Chuang, Tin-Hao Kuo | 2020-07-21 |