Issued Patents All Time
Showing 1–25 of 125 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431446 | Package structure | Chih-Hsuan Tai, Ting-Ting Kuo, Yu-Chih Huang, Chih-Wei Lin, Hsiu-Jen Lin +4 more | 2025-09-30 |
| 12394242 | Fingerprint sensor device and method | Yu-Chih Huang, Yu-Jen Cheng, Chih-Wei Lin, Yu-Feng Chen, Hao-Yi Tsai +2 more | 2025-08-19 |
| 12260669 | Fingerprint sensor in InFO structure and formation method | Yu-Feng Chen, Chung-Shi Liu, Chen-Hua Yu, Hao-Yi Tsai, Yu-Chih Huang | 2025-03-25 |
| 12255196 | Semiconductor package with thermal relaxation block and manufacturing method thereof | Shih-Wei Chen, Hsin-Yu Pan, Hao-Yi Tsai, Lipu Kris Chuang, Tin-Hao Kuo | 2025-03-18 |
| 12068212 | Package structure with through via extending through redistribution layer and method of manufacturing the same | Chih-Hsuan Tai, Hao-Yi Tsai, Yu-Chih Huang, Chia-Hung Liu, Ting-Ting Kuo | 2024-08-20 |
| 12058101 | Package structure and method of forming the same | Chen-Hua Yu, Hao-Yi Tsai, Yu-Feng Chen | 2024-08-06 |
| 12017342 | Robot gripper for moving wafer carriers and packing materials and method of operating the same | Chien-Fa Lee, Feng-Kuang Wu, FU-CHENG HUNG, Chi-Wei Chen | 2024-06-25 |
| 12009322 | Package structure with through-via in molding compound and dielectric layer | Chih-Hsuan Tai, Ting-Ting Kuo, Yu-Chih Huang, Chih-Wei Lin, Hsiu-Jen Lin +4 more | 2024-06-11 |
| 11961791 | Package structures and methods for forming the same | Ching-Wen Hsiao, Ming-Da Cheng, Chih-Wei Lin, Chen-Shien Chen, Chen-Cheng Kuo | 2024-04-16 |
| 11948862 | Package structures and method of forming the same | Chen-Hua Yu, Hao-Yi Tsai, Yu-Feng Chen | 2024-04-02 |
| 11847852 | Manufacturing method of fingerprint sensor | Chih-Hsuan Tai, Hao-Yi Tsai, Yu-Chih Huang, Chia-Hung Liu, Ting-Ting Kuo +1 more | 2023-12-19 |
| 11830781 | Package structure and manufacturing method thereof | Wei-Yu Chen, Ching-Hua Hsieh, Hsiu-Jen Lin, Yu-Chih Huang, Yu-Peng Tsai +3 more | 2023-11-28 |
| 11830866 | Semiconductor package with thermal relaxation block and manufacturing method thereof | Shih-Wei Chen, Hsin-Yu Pan, Hao-Yi Tsai, Lipu Kris Chuang, Tin-Hao Kuo | 2023-11-28 |
| 11749640 | Semiconductor package and method of manufacturing the same | Shih-Wei Chen, Hsin-Yu Pan, Hao-Yi Tsai, Lipu Kris Chuang, Tin-Hao Kuo | 2023-09-05 |
| 11747899 | Gaze-based window adjustments | Yi-Chen Chen, Nick Thamma, King Sui Kei, Kun-Cheng Tsai | 2023-09-05 |
| 11741737 | Fingerprint sensor in info structure and formation method | Yu-Feng Chen, Chung-Shi Liu, Chen-Hua Yu, Hao-Yi Tsai, Yu-Chih Huang | 2023-08-29 |
| 11742217 | Passive devices in package-on-package structures and methods for forming the same | Chen-Shien Chen | 2023-08-29 |
| 11727714 | Fingerprint sensor device and method | Yu-Chih Huang, Yu-Jen Cheng, Chih-Wei Lin, Yu-Feng Chen, Hao-Yi Tsai +2 more | 2023-08-15 |
| 11712390 | Oral rehabilitation device and medical treatment system therewith | Mu-Kuan Chen, Gene Chen, Po-Te Lin, Ming-Yu Hsieh, Mei-Hui Chang | 2023-08-01 |
| 11685055 | Robot gripper for moving wafer carriers and packing materials and method of operating the same | Chien-Fa Lee, Feng-Kuang Wu, FU-CHENG HUNG, Chi-Wei Chen | 2023-06-27 |
| 11625940 | Fingerprint sensor device and method | Chen-Hua Yu, Yu-Feng Chen, Hao-Yi Tsai, Chung-Shi Liu | 2023-04-11 |
| 11599190 | Pivotable acoustic devices | Cheng-Yi Yang, Hai-Lung Hung | 2023-03-07 |
| 11580767 | Fingerprint sensor | Chih-Hsuan Tai, Hao-Yi Tsai, Yu-Chih Huang, Chia-Hung Liu, Ting-Ting Kuo +1 more | 2023-02-14 |
| 11488878 | Packaging mechanisms for dies with different sizes of connectors | Chen-Shien Chen, Ching-Wen Hsiao | 2022-11-01 |
| 11482491 | Package structure with porous conductive structure and manufacturing method thereof | Wei-Yu Chen, Ching-Hua Hsieh, Hsiu-Jen Lin, Yu-Chih Huang, Yu-Peng Tsai +3 more | 2022-10-25 |