Issued Patents All Time
Showing 1–25 of 229 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12412817 | Integrated circuit package and method | Chi-Hui Lai, Shu-Rong Chun, Kuo Lung Pan, Hao-Yi Tsai, Chung-Shi Liu +1 more | 2025-09-09 |
| 12368141 | IPD modules with flexible connection scheme in packaging | Yu-Chia Lai, Cheng-Chieh Hsieh, Hao-Yi Tsai, Chung-Shi Liu, Chen-Hua Yu | 2025-07-22 |
| 12354926 | Package and method for manufacturing the same | Chen-Hua Yu | 2025-07-08 |
| 12322706 | Chip package and method of forming the same | Kuo Lung Pan, Hao-Yi Tsai | 2025-06-03 |
| 12300618 | Semiconductor device having a heat dissipation structure connected chip package | Po-Yuan Teng, Hung-Yi Kuo, Hao-Yi Tsai, Yu-Chia Lai, Shih-Wei Chen | 2025-05-13 |
| 12300571 | Integrated circuit package and method | Shu-Rong Chun, Kuo Lung Pan, Pei-Hsuan Lee, Chien Ling Hwang, Yu-Chia Lai +2 more | 2025-05-13 |
| 12278208 | Method of fabricating semiconductor structure including a barrier structure in between a plurality of surface mount components and a wafer | Mao-Yen Chang, Chih-Wei Lin, Hao-Yi Tsai, Kuo Lung Pan, Chun-Cheng Lin +2 more | 2025-04-15 |
| 12261126 | Semiconductor package | Tsung-Hsien Chiang, Hsien-Ming Tu, Hao-Yi Tsai | 2025-03-25 |
| 12255196 | Semiconductor package with thermal relaxation block and manufacturing method thereof | Shih-Wei Chen, Chih-Hua Chen, Hsin-Yu Pan, Hao-Yi Tsai, Lipu Kris Chuang | 2025-03-18 |
| 12255174 | Bonding passive devices on active dies to form 3D packages | Chen-Hua Yu, Kuo Lung Pan, Shu-Rong Chun, Chi-Hui Lai, Hao-Yi Tsai +1 more | 2025-03-18 |
| 12255184 | Semiconductor packages and methods of forming the same | Chen-Hua Yu, Ming Hung Tseng, Yen-Liang Lin, Tzu-Sung Huang, Hao-Yi Tsai | 2025-03-18 |
| 12230513 | Cross-wafer RDLs in constructed wafers | Chen-Hua Yu | 2025-02-18 |
| 12218006 | System, device and methods of manufacture | Chen-Hua Yu, Wei Ling Chang, Chuei-Tang Wang, Che-Wei Hsu | 2025-02-04 |
| 12205923 | Semiconductor device, circuit board structure and manufacturing method thereof | Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Yu-Chia Lai, Po-Yuan Teng | 2025-01-21 |
| 12199051 | Integrated circuit structure and method | Chen-Hua Yu, Kuo Lung Pan, Hao-Yi Tsai | 2025-01-14 |
| 12159851 | Package structure having hollow cylinders and method of fabricating the same | Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai | 2024-12-03 |
| 12159839 | Semiconductor packages | Tzu-Sung Huang, Hsiu-Jen Lin, Hao-Yi Tsai, Ming Hung Tseng, Tsung-Hsien Chiang +1 more | 2024-12-03 |
| 12142597 | Integrated fan-out package and the methods of manufacturing | Chen-Hua Yu, Kuo-Chung Yee, Hao-Yi Tsai | 2024-11-12 |
| 12136612 | Three-dimension large system integration | Chen-Hua Yu | 2024-11-05 |
| 12125804 | Semiconductor package and manufacturing method thereof | Wei-Kang Hsieh, Hao-Yi Tsai, Shih-Wei Chen | 2024-10-22 |
| 12087718 | Bump structure having a side recess and semiconductor structure including the same | Chih-Horng Chang, Chen-Shien Chen, Yen-Liang Lin | 2024-09-10 |
| 12080615 | Method of manufacturing an integrated fan-out package having fan-out redistribution layer (RDL) to accommodate electrical connectors | Chen-Hua Yu, Kuo-Chung Yee, Hao-Yi Tsai | 2024-09-03 |
| 12074143 | Integrated circuit package and method | Chen-Hua Yu, Chi-Hui Lai, Hao-Yi Tsai, Chung-Shi Liu | 2024-08-27 |
| 12057405 | Packages with thick RDLs and thin RDLs stacked alternatingly | Po-Yuan Teng, Kuo Lung Pan, Yu-Chia Lai, Hao-Yi Tsai, Chen-Hua Yu | 2024-08-06 |
| 12051666 | Package structure and manufacturing method of package structure thereof | Po-Yuan Teng, Hao-Yi Tsai, Kuo Lung Pan, Sen-Kuei Hsu, Yi-Yang Lei +2 more | 2024-07-30 |