Issued Patents All Time
Showing 1–25 of 36 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12406941 | Dielectric slots underneath conductive vias in interconnect structure of semiconductor package and method of forming the same | Yi-Che Chiang, Chien-Hsun Chen, Tuan-Yu Hung, Hsin-Yu Pan, Wei-Kang Hsieh +8 more | 2025-09-02 |
| 12388041 | Semiconductor package | Kris Lipu Chuang, Hsiu-Jen Lin, Hsin-Yu Pan | 2025-08-12 |
| 12374627 | Method of fabricating semiconductor structure | Cheng-Chieh Hsieh, Hsiu-Jen Lin, Hui-Jung Tsai, Hung-Yi Kuo, Hao-Yi Tsai +4 more | 2025-07-29 |
| 12362270 | Package structure and method of fabricating the same | Kris Lipu Chuang, Chih-Wei Lin, Yu-Fu Chen, Hsin-Yu Pan, Hao-Yi Tsai | 2025-07-15 |
| 12362329 | Method of fabricating semiconductor package | Hao-Yi Tsai, Cheng-Chieh Hsieh, Tsung-Hsien Chiang, Hui-Chun Chiang, Ming Hung Tseng +4 more | 2025-07-15 |
| 12288729 | Integrated circuit package and method | Ming Hung Tseng, Yen-Liang Lin, Hao-Yi Tsai, Chi-Ming Tsai, Chung-Shi Liu +2 more | 2025-04-29 |
| 12266639 | Method of fabricating semiconductor package | Hao-Yi Tsai, Cheng-Chieh Hsieh, Tsung-Hsien Chiang, Hui-Chun Chiang, Ming Hung Tseng +4 more | 2025-04-01 |
| 12261092 | Semiconductor package and manufacturing method thereof | Ming Hung Tseng, Yen-Liang Lin, Ban-Li Wu, Hsiu-Jen Lin, Teng-Yuan Lo +1 more | 2025-03-25 |
| 12255184 | Semiconductor packages and methods of forming the same | Chen-Hua Yu, Ming Hung Tseng, Yen-Liang Lin, Tin-Hao Kuo, Hao-Yi Tsai | 2025-03-18 |
| 12159839 | Semiconductor packages | Hsiu-Jen Lin, Hao-Yi Tsai, Ming Hung Tseng, Tsung-Hsien Chiang, Tin-Hao Kuo +1 more | 2024-12-03 |
| 12040283 | Method of fabricating semiconductor structure | Cheng-Chieh Hsieh, Hsiu-Jen Lin, Hui-Jung Tsai, Hung-Yi Kuo, Hao-Yi Tsai +4 more | 2024-07-16 |
| 11996227 | Hexagonal semiconductor package structure | Chen-Hua Yu, Hao-Yi Tsai, Hung-Yi Kuo, Ming Hung Tseng | 2024-05-28 |
| 11942433 | Integrated circuit package and method | Chen-Hua Yu, Jen-Fu Liu, Ming Hung Tseng, Tsung-Hsien Chiang, Yen-Liang Lin | 2024-03-26 |
| 11935871 | Semiconductor package and method of fabricating the same | Hao-Yi Tsai, Cheng-Chieh Hsieh, Tsung-Hsien Chiang, Hui-Chun Chiang, Ming Hung Tseng +4 more | 2024-03-19 |
| 11935804 | Integrated circuit package and method | Ming Hung Tseng, Yen-Liang Lin, Hao-Yi Tsai, Chi-Ming Tsai, Chung-Shi Liu +2 more | 2024-03-19 |
| 11848288 | Semiconductor device and method | Chen-Hua Yu, Hung-Yi Kuo, Hao-Yi Tsai, Ming Hung Tseng | 2023-12-19 |
| 11837517 | Packaged semiconductor devices with wireless charging means | Chen-Hua Yu, Hao-Yi Tsai, Ming Hung Tseng, Hung-Yi Kuo | 2023-12-05 |
| 11682655 | Semiconductor packages and methods of forming the same | Chen-Hua Yu, Ming Hung Tseng, Yen-Liang Lin, Tin-Hao Kuo, Hao-Yi Tsai | 2023-06-20 |
| 11664325 | Semiconductor structure and method of fabricating the same | Cheng-Chieh Hsieh, Hsiu-Jen Lin, Hui-Jung Tsai, Hung-Yi Kuo, Hao-Yi Tsai +4 more | 2023-05-30 |
| 11626339 | Integrated circuit package and method | Ming Hung Tseng, Yen-Liang Lin, Hao-Yi Tsai, Chi-Ming Tsai, Chung-Shi Liu +2 more | 2023-04-11 |
| 11532425 | Hexagonal semiconductor package structure | Chen-Hua Yu, Hao-Yi Tsai, Hung-Yi Kuo, Ming Hung Tseng | 2022-12-20 |
| 11502039 | Semiconductor package and method | Hsiu-Jen Lin, Hao-Yi Tsai, Ming Hung Tseng, Tsung-Hsien Chiang, Tin-Hao Kuo +1 more | 2022-11-15 |
| 11251644 | Packaged semiconductor devices with wireless charging means | Chen-Hua Yu, Hao-Yi Tsai, Ming Hung Tseng, Hung-Yi Kuo | 2022-02-15 |
| 11244906 | Semiconductor structure and method of fabricating the same | Cheng-Chieh Hsieh, Hsiu-Jen Lin, Hui-Jung Tsai, Hung-Yi Kuo, Hao-Yi Tsai +4 more | 2022-02-08 |
| 11227837 | Integrated circuit package and method | Chen-Hua Yu, Jen-Fu Liu, Ming Hung Tseng, Tsung-Hsien Chiang, Yen-Liang Lin | 2022-01-18 |