Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12362329 | Method of fabricating semiconductor package | Hao-Yi Tsai, Cheng-Chieh Hsieh, Tsung-Hsien Chiang, Tzu-Sung Huang, Ming Hung Tseng +4 more | 2025-07-15 |
| 12266639 | Method of fabricating semiconductor package | Hao-Yi Tsai, Cheng-Chieh Hsieh, Tsung-Hsien Chiang, Tzu-Sung Huang, Ming Hung Tseng +4 more | 2025-04-01 |
| 12087597 | Semiconductor structure comprising various via structures | Jen-Fu Liu, Ming Hung Tseng, Yen-Liang Lin, Li-Ko Yeh, Cheng-Chieh Wu | 2024-09-10 |
| 11935871 | Semiconductor package and method of fabricating the same | Hao-Yi Tsai, Cheng-Chieh Hsieh, Tsung-Hsien Chiang, Tzu-Sung Huang, Ming Hung Tseng +4 more | 2024-03-19 |
| 11715646 | Semiconductor structure and method for forming the same | Jen-Fu Liu, Ming Hung Tseng, Yen-Liang Lin, Li-Ko Yeh, Cheng-Chieh Wu | 2023-08-01 |