Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12087597 | Semiconductor structure comprising various via structures | Ming Hung Tseng, Yen-Liang Lin, Li-Ko Yeh, Hui-Chun Chiang, Cheng-Chieh Wu | 2024-09-10 |
| 11942433 | Integrated circuit package and method | Chen-Hua Yu, Ming Hung Tseng, Tsung-Hsien Chiang, Yen-Liang Lin, Tzu-Sung Huang | 2024-03-26 |
| 11715646 | Semiconductor structure and method for forming the same | Ming Hung Tseng, Yen-Liang Lin, Li-Ko Yeh, Hui-Chun Chiang, Cheng-Chieh Wu | 2023-08-01 |
| 11227837 | Integrated circuit package and method | Chen-Hua Yu, Ming Hung Tseng, Tsung-Hsien Chiang, Yen-Liang Lin, Tzu-Sung Huang | 2022-01-18 |
| 7214611 | Imprinting-damascene process for metal interconnection | Yung Jen Hsu, Jiann-Heng Chen, Fon-Shan Huang | 2007-05-08 |