Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7214611 | Imprinting-damascene process for metal interconnection | Jen-Fu Liu, Yung Jen Hsu, Jiann-Heng Chen | 2007-05-08 |
| 6511609 | Cu seed layer deposition for ULSI metalization | Ching-Han Jan, Jih-Wen Wang | 2003-01-28 |