Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12406941 | Dielectric slots underneath conductive vias in interconnect structure of semiconductor package and method of forming the same | Yi-Che Chiang, Chien-Hsun Chen, Tuan-Yu Hung, Hsin-Yu Pan, Tsung-Hsien Chiang +8 more | 2025-09-02 |
| 12374592 | Semiconductor device and manufacturing method thereof | Cheng-Chieh Wu, Ting Hao Kuo, Kuo Lung Pan, Po-Yuan Teng, Yu-Chia Lai +7 more | 2025-07-29 |
| 12166015 | Semiconductor package and manufacturing method of semiconductor package | Hung-Yi Kuo, Hao-Yi Tsai, Kuo Lung Pan, Ting Hao Kuo, Yu-Chia Lai +3 more | 2024-12-10 |
| 12125804 | Semiconductor package and manufacturing method thereof | Hao-Yi Tsai, Tin-Hao Kuo, Shih-Wei Chen | 2024-10-22 |
| 11854986 | Chamfered die of semiconductor package and method for forming the same | Chen-Hua Yu, Shih-Wei Chen, Tin-Hao Kuo, Hao-Yi Tsai | 2023-12-26 |
| 11824017 | Semiconductor package and manufacturing method thereof | Hao-Yi Tsai, Tin-Hao Kuo, Shih-Wei Chen | 2023-11-21 |
| 11682626 | Chamfered die of semiconductor package and method for forming the same | Chen-Hua Yu, Shih-Wei Chen, Tin-Hao Kuo, Hao-Yi Tsai | 2023-06-20 |
| 11646296 | Semiconductor package and manufacturing method of semiconductor package | Hung-Yi Kuo, Hao-Yi Tsai, Kuo Lung Pan, Ting Hao Kuo, Yu-Chia Lai +3 more | 2023-05-09 |
| 11515268 | Semiconductor package and manufacturing method thereof | Hao-Yi Tsai, Tin-Hao Kuo, Shih-Wei Chen | 2022-11-29 |
| 11004827 | Semiconductor package and manufacturing method of semiconductor package | Hung-Yi Kuo, Hao-Yi Tsai, Kuo Lung Pan, Tin-Hao Kuo, Yu-Chia Lai +3 more | 2021-05-11 |