Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12388060 | Integrated fan-out packages and methods of forming the same | Chen-Hua Yu, Kuo Lung Pan, Hao-Yi Tsai, Hsiu-Jen Lin, Hao-Jan Pei +1 more | 2025-08-12 |
| 12374592 | Semiconductor device and manufacturing method thereof | Cheng-Chieh Wu, Kuo Lung Pan, Po-Yuan Teng, Yu-Chia Lai, Shu-Rong Chun +7 more | 2025-07-29 |
| 12166015 | Semiconductor package and manufacturing method of semiconductor package | Wei-Kang Hsieh, Hung-Yi Kuo, Hao-Yi Tsai, Kuo Lung Pan, Yu-Chia Lai +3 more | 2024-12-10 |
| 11942451 | Semiconductor structure and method of forming the same | Mao-Yen Chang, Yu-Chia Lai, Cheng-Shiuan Wong, Ching-Hua Hsieh, Hao-Yi Tsai +2 more | 2024-03-26 |
| 11664315 | Structure with interconnection die and method of making same | Hao-Yi Tsai, Tzuan-Horng Liu | 2023-05-30 |
| 11646296 | Semiconductor package and manufacturing method of semiconductor package | Wei-Kang Hsieh, Hung-Yi Kuo, Hao-Yi Tsai, Kuo Lung Pan, Yu-Chia Lai +3 more | 2023-05-09 |