Issued Patents All Time
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12412817 | Integrated circuit package and method | Chi-Hui Lai, Kuo Lung Pan, Tin-Hao Kuo, Hao-Yi Tsai, Chung-Shi Liu +1 more | 2025-09-09 |
| 12374592 | Semiconductor device and manufacturing method thereof | Cheng-Chieh Wu, Ting Hao Kuo, Kuo Lung Pan, Po-Yuan Teng, Yu-Chia Lai +7 more | 2025-07-29 |
| 12300571 | Integrated circuit package and method | Kuo Lung Pan, Pei-Hsuan Lee, Chien Ling Hwang, Yu-Chia Lai, Tin-Hao Kuo +2 more | 2025-05-13 |
| 12255174 | Bonding passive devices on active dies to form 3D packages | Chen-Hua Yu, Kuo Lung Pan, Chi-Hui Lai, Tin-Hao Kuo, Hao-Yi Tsai +1 more | 2025-03-18 |
| 12166015 | Semiconductor package and manufacturing method of semiconductor package | Wei-Kang Hsieh, Hung-Yi Kuo, Hao-Yi Tsai, Kuo Lung Pan, Ting Hao Kuo +3 more | 2024-12-10 |
| 12014979 | Methods of forming semiconductor packages | Kuo Lung Pan, Teng-Yuan Lo, Hung-Yi Kuo, Chih-Horng Chang, Tin-Hao Kuo +1 more | 2024-06-18 |
| 11990381 | Integrated circuit packages having support rings | Kuo Lung Pan, Tin-Hao Kuo, Hao-Yi Tsai, Pei-Hsuan Lee, Chien Ling Hwang +3 more | 2024-05-21 |
| 11837575 | Bonding passive devices on active device dies to form 3D packages | Chen-Hua Yu, Kuo Lung Pan, Chi-Hui Lai, Tin-Hao Kuo, Hao-Yi Tsai +1 more | 2023-12-05 |
| 11804443 | Segregated power and ground design for yield improvement | Tin-Hao Kuo, Chi-Hui Lai, Kuo Lung Pan, Yu-Chia Lai, Hao-Yi Tsai +2 more | 2023-10-31 |
| 11646296 | Semiconductor package and manufacturing method of semiconductor package | Wei-Kang Hsieh, Hung-Yi Kuo, Hao-Yi Tsai, Kuo Lung Pan, Ting Hao Kuo +3 more | 2023-05-09 |
| 11538735 | Method of forming integrated circuit packages with mechanical braces | Kuo Lung Pan, Pei-Hsuan Lee, Chien Ling Hwang, Yu-Chia Lai, Tin-Hao Kuo +2 more | 2022-12-27 |
| 11508656 | Semiconductor package and method | Kuo Lung Pan, Teng-Yuan Lo, Hung-Yi Kuo, Chih-Horng Chang, Tin-Hao Kuo +1 more | 2022-11-22 |
| 11502013 | Integrated circuit package and method | Kuo Lung Pan, Tin-Hao Kuo, Hao-Yi Tsai, Pei-Hsuan Lee, Chien Ling Hwang +3 more | 2022-11-15 |
| 11488897 | Integrated circuit package and method | Chi-Hui Lai, Kuo Lung Pan, Tin-Hao Kuo, Hao-Yi Tsai, Chung-Shi Liu +1 more | 2022-11-01 |
| 11183487 | Integrated circuit package and method | Chi-Hui Lai, Kuo Lung Pan, Tin-Hao Kuo, Hao-Yi Tsai, Chung-Shi Liu +2 more | 2021-11-23 |
| 11121070 | Integrated fan-out package | Tin-Hao Kuo, Chi-Hui Lai, Kuo Lung Pan, Hao-Yi Tsai, Chung-Shi Liu +1 more | 2021-09-14 |
| 11107771 | Segregated power and ground design for yield improvement | Tin-Hao Kuo, Chi-Hui Lai, Kuo Lung Pan, Yu-Chia Lai, Hao-Yi Tsai +2 more | 2021-08-31 |
| 11049805 | Semiconductor package and method | Kuo Lung Pan, Teng-Yuan Lo, Hung-Yi Kuo, Chih-Horng Chang, Tin-Hao Kuo +1 more | 2021-06-29 |
| 11004827 | Semiconductor package and manufacturing method of semiconductor package | Wei-Kang Hsieh, Hung-Yi Kuo, Hao-Yi Tsai, Kuo Lung Pan, Tin-Hao Kuo +3 more | 2021-05-11 |
| 11004758 | Integrated circuit package and method | Kuo Lung Pan, Tin-Hao Kuo, Hao-Yi Tsai, Pei-Hsuan Lee, Chien Ling Hwang +3 more | 2021-05-11 |
| 10978382 | Integrated circuit package and method | Chi-Hui Lai, Kuo Lung Pan, Tin-Hao Kuo, Hao-Yi Tsai, Chung-Shi Liu +1 more | 2021-04-13 |