Issued Patents All Time
Showing 1–25 of 34 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12412817 | Integrated circuit package and method | Shu-Rong Chun, Kuo Lung Pan, Tin-Hao Kuo, Hao-Yi Tsai, Chung-Shi Liu +1 more | 2025-09-09 |
| 12255174 | Bonding passive devices on active dies to form 3D packages | Chen-Hua Yu, Kuo Lung Pan, Shu-Rong Chun, Tin-Hao Kuo, Hao-Yi Tsai +1 more | 2025-03-18 |
| 12243788 | Method of testing semiconductor package | Yang-Che Chen, Chen-Hua Lin, Victor Chiang Liang, Chwen-Ming Liu | 2025-03-04 |
| 12205860 | Sensor packages | Tsung-Hsien Chiang, Yu-Chih Huang, Ting-Ting Kuo, Chih-Hsuan Tai, Ban-Li Wu +5 more | 2025-01-21 |
| 12074143 | Integrated circuit package and method | Chen-Hua Yu, Tin-Hao Kuo, Hao-Yi Tsai, Chung-Shi Liu | 2024-08-27 |
| 12051666 | Package structure and manufacturing method of package structure thereof | Po-Yuan Teng, Hao-Yi Tsai, Kuo Lung Pan, Sen-Kuei Hsu, Tin-Hao Kuo +2 more | 2024-07-30 |
| 12015017 | Package structure, package-on-package structure and method of fabricating the same | Chih-Hsuan Tai, Hao-Yi Tsai, Yu-Chih Huang, Chia-Hung Liu, Ting-Ting Kuo +2 more | 2024-06-18 |
| 12009281 | Package structure and method of manufacturing the same | Shih-Wei Chen, Hao-Yi Tsai, Kuo Lung Pan, Tin-Hao Kuo, Po-Yuan Teng | 2024-06-11 |
| 11923349 | Semiconductor structures | Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Tin-Hao Kuo | 2024-03-05 |
| 11842993 | Semiconductor device with multiple polarity groups | Ying-Cheng Tseng, Yu-Chih Huang, Chih-Hsuan Tai, Ting-Ting Kuo, Ban-Li Wu +2 more | 2023-12-12 |
| 11837575 | Bonding passive devices on active device dies to form 3D packages | Chen-Hua Yu, Kuo Lung Pan, Shu-Rong Chun, Tin-Hao Kuo, Hao-Yi Tsai +1 more | 2023-12-05 |
| 11804443 | Segregated power and ground design for yield improvement | Shu-Rong Chun, Tin-Hao Kuo, Kuo Lung Pan, Yu-Chia Lai, Hao-Yi Tsai +2 more | 2023-10-31 |
| 11769698 | Method of testing semiconductor package | Yang-Che Chen, Chen-Hua Lin, Victor Chiang Liang, Chwen-Ming Liu | 2023-09-26 |
| 11742254 | Sensor package and method | Tsung-Hsien Chiang, Yu-Chih Huang, Ting-Ting Kuo, Chih-Hsuan Tai, Ban-Li Wu +5 more | 2023-08-29 |
| 11631658 | Under-bump-metallization structure and redistribution layer design for integrated fan-out package with integrated passive device | Yu-Chih Huang, Ban-Li Wu, Ying-Cheng Tseng, Ting-Ting Kuo, Chih-Hsuan Tai +5 more | 2023-04-18 |
| 11527525 | Semiconductor device with multiple polarity groups | Ying-Cheng Tseng, Yu-Chih Huang, Chih-Hsuan Tai, Ting-Ting Kuo, Ban-Li Wu +2 more | 2022-12-13 |
| 11488897 | Integrated circuit package and method | Shu-Rong Chun, Kuo Lung Pan, Tin-Hao Kuo, Hao-Yi Tsai, Chung-Shi Liu +1 more | 2022-11-01 |
| 11417633 | Integrated circuit package and method | Chen-Hua Yu, Tin-Hao Kuo, Hao-Yi Tsai, Chung-Shi Liu | 2022-08-16 |
| 11417638 | Semiconductor structures | Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Tin-Hao Kuo | 2022-08-16 |
| 11355466 | Package structure and manufacturing method of package structure thereof | Po-Yuan Teng, Hao-Yi Tsai, Kuo Lung Pan, Sen-Kuei Hsu, Tin-Hao Kuo +2 more | 2022-06-07 |
| 11239135 | Package structure and method of manufacturing the same | Shih-Wei Chen, Hao-Yi Tsai, Kuo Lung Pan, Tin-Hao Kuo, Po-Yuan Teng | 2022-02-01 |
| 11183487 | Integrated circuit package and method | Shu-Rong Chun, Kuo Lung Pan, Tin-Hao Kuo, Hao-Yi Tsai, Chung-Shi Liu +2 more | 2021-11-23 |
| 11164819 | Semiconductor package and manufacturing method thereof | Ying-Cheng Tseng, Hao-Yi Tsai, Tin-Hao Kuo, Chia-Hung Liu | 2021-11-02 |
| 11121070 | Integrated fan-out package | Shu-Rong Chun, Tin-Hao Kuo, Kuo Lung Pan, Hao-Yi Tsai, Chung-Shi Liu +1 more | 2021-09-14 |
| 11107771 | Segregated power and ground design for yield improvement | Shu-Rong Chun, Tin-Hao Kuo, Kuo Lung Pan, Yu-Chia Lai, Hao-Yi Tsai +2 more | 2021-08-31 |