Issued Patents All Time
Showing 1–25 of 27 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12426283 | Semiconductor structure and method of manufacturing the same | Wei-Yu Chou, Yi Yang | 2025-09-23 |
| 12243788 | Method of testing semiconductor package | Chi-Hui Lai, Chen-Hua Lin, Victor Chiang Liang, Chwen-Ming Liu | 2025-03-04 |
| 12183655 | Semiconductor device with enhanced thermal dissipation and method for making the same | Chen-Hua Lin, Huang-Wen Tseng, Victor Chiang Liang, Chwen-Ming Liu | 2024-12-31 |
| 12027433 | Semiconductor package and method for making the same | Chen-Hua Lin, Huang-Wen Tseng, Victor Chiang Liang, Chwen-Ming Liu | 2024-07-02 |
| 11993512 | Dual micro-electro mechanical system and manufacturing method thereof | Victor Chiang Liang, Chen-Hua Lin, Chwen-Ming Liu, Huang-Wen Tseng, Yi-Chuan Teng | 2024-05-28 |
| 11908884 | Inductive device | Wei-Yu Chou, Chen-Hua Lin, Victor Chiang Liang, Huang-Wen Tseng, Chwen-Ming Liu | 2024-02-20 |
| 11854913 | Method for detecting defects in semiconductor device | Wei-Yu Chou, Hong-Seng Shue, Chen-Hua Lin, Huang-Wen Tseng, Victor Chiang Liang +1 more | 2023-12-26 |
| 11837526 | Semiconductor package structure and method for manufacturing the same | Chen-Hua Lin, Huang-Wen Tseng, Victor Chiang Liang, Chwen-Ming Liu | 2023-12-05 |
| 11804433 | Semiconductor package structure and method for forming the same | Chen-Hua Lin, Victor Chiang Liang, Huang-Wen Tseng, Chwen-Ming Liu | 2023-10-31 |
| 11776919 | Semiconductor package | Victor Chiang Liang, Chen-Hua Lin, Chwen-Ming Liu, Huang-Wen Tseng | 2023-10-03 |
| 11769698 | Method of testing semiconductor package | Chi-Hui Lai, Chen-Hua Lin, Victor Chiang Liang, Chwen-Ming Liu | 2023-09-26 |
| 11721597 | Semiconductor device and manufacturing method of the same | Chen-Hua Lin, Victor Chiang Liang, Huang-Wen Tseng, Chwen-Ming Liu | 2023-08-08 |
| 11626343 | Semiconductor device with enhanced thermal dissipation and method for making the same | Chen-Hua Lin, Huang-Wen Tseng, Victor Chiang Liang, Chwen-Ming Liu | 2023-04-11 |
| 11482461 | Semiconductor package and method for making the same | Chen-Hua Lin, Huang-Wen Tseng, Victor Chiang Liang, Chwen-Ming Liu | 2022-10-25 |
| 11450626 | Semiconductor package | Victor Chiang Liang, Chen-Hua Lin, Chwen-Ming Liu, Huang-Wen Tseng | 2022-09-20 |
| 11322576 | Inductive device | Wei-Yu Chou, Chen-Hua Lin, Victor Chiang Liang, Huang-Wen Tseng, Chwen-Ming Liu | 2022-05-03 |
| 11274037 | Dual micro-electro mechanical system and manufacturing method thereof | Victor Chiang Liang, Chen-Hua Lin, Chwen-Ming Liu, Huang-Wen Tseng, Yi-Chuan Teng | 2022-03-15 |
| 11088037 | Semiconductor device having probe pads and seal ring | Wei-Yu Chou, Hong-Seng Shue, Chen-Hua Lin, Huang-Wen Tseng, Victor Chiang Liang +1 more | 2021-08-10 |
| 10937858 | Method for manufacturing semiconductor and structure thereof | Chen-Hua Lin, Huang-Wen Tseng, Victor Chiang Liang, Chwen-Ming Liu | 2021-03-02 |
| 10937772 | Semiconductor package and method for manufacturing the same | Chen-Hua Lin, Huang-Wen Tseng, Victor Chiang Liang, Chwen-Ming Liu | 2021-03-02 |
| 10867976 | Semiconductor packages having dummy connectors and methods of forming same | Chen-Shien Chen, Hsiu-Jen Lin, Ming-Chih Yew, Ming-Da Cheng, Yi-Jen Lai +2 more | 2020-12-15 |
| 10699977 | Method of detecting delamination in an integrated circuit package structure | Tsung-Te Chou, Chen-Hua Lin, Huang-Wen Tseng, Chwen-Ming Liu | 2020-06-30 |
| 10629673 | Method for manufacturing semiconductor and structure thereof | Chen-Hua Lin, Huang-Wen Tseng, Victor Chiang Liang, Chwen-Ming Liu | 2020-04-21 |
| 10510734 | Semiconductor packages having dummy connectors and methods of forming same | Chen-Shien Chen, Hsiu-Jen Lin, Ming-Chih Yew, Ming-Da Cheng, Yi-Jen Lai +2 more | 2019-12-17 |
| 10347548 | Integrated circuit package structure and testing method using the same | Tsung-Te Chou, Chen-Hua Lin, Huang-Wen Tseng, Chwen-Ming Liu | 2019-07-09 |