Issued Patents All Time
Showing 1–25 of 46 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12391545 | Semiconductor device and method for fabricating the same | Chun-Wen Cheng, Cheng-Yu Hsieh, Lee-Chuan Tseng, Shih-Chang Liu, Shih-Wei Lin | 2025-08-19 |
| 12202724 | Micro electro mechanical system (MEMs) device having metal sealing on necking portion of vent hole | Ching-Kai Shen, Wei-Chu Lin, Hung-Wei Liang, Jung-Kuo Tu | 2025-01-21 |
| 12082505 | Integrated heater (and related method) to recover degraded piezoelectric device performance | Alexander Kalnitsky, Chun-Ren Cheng, Chi-Yuan Shih, Kai-Fung Chang, Shih-Fen Huang +3 more | 2024-09-03 |
| 12074110 | Method for manufacturing semiconductor device | Ching-Kai Shen, Wei-Chu Lin, Hung-Wei Liang, Jung-Kuo Tu | 2024-08-27 |
| 12062585 | Wafer-level device measurement for optical sensors | Chien-Yu Chen, Yu-Hsuan Liu, Yun-Chung Na | 2024-08-13 |
| 12043538 | Semiconductor device structure with movable membrane | Chun-Yin Tsai, Chia-Hua Chu, Chun-Wen Cheng | 2024-07-23 |
| 12017908 | Semiconductor structure and method for forming the same | Ching-Kai Shen, Jung-Kuo Tu, Wei-Cheng Shen | 2024-06-25 |
| 11993512 | Dual micro-electro mechanical system and manufacturing method thereof | Yang-Che Chen, Victor Chiang Liang, Chen-Hua Lin, Chwen-Ming Liu, Huang-Wen Tseng | 2024-05-28 |
| 11984261 | Integration scheme for breakdown voltage enhancement of a piezoelectric metal-insulator-metal device | Anderson Lin, Chun-Ren Cheng, Chi-Yuan Shih, Shih-Fen Huang, Yi Heng Tsai +6 more | 2024-05-14 |
| 11851318 | MEMS device and method for making the same | Ching-Kai Shen, Jung-Kuo Tu, Wei-Cheng Shen, Xin-Hua Huang, Wei-Chu Lin | 2023-12-26 |
| 11807520 | Semiconductor structure and method for manufacturing thereof | Ching-Kai Shen, Jung-Kuo Tu | 2023-11-07 |
| 11772960 | Method of forming dielectric and metal sealing layers on capping structure of a MEMs device | Ching-Kai Shen, Wei-Chu Lin, Hung-Wei Liang, Jung-Kuo Tu | 2023-10-03 |
| 11730058 | Integrated heater (and related method) to recover degraded piezoelectric device performance | Alexander Kalnitsky, Chun-Ren Cheng, Chi-Yuan Shih, Kai-Fung Chang, Shih-Fen Huang +3 more | 2023-08-15 |
| 11516596 | MEMS device and manufacturing method thereof | Wei-Chu Lin, Jung-Kuo Tu | 2022-11-29 |
| 11462478 | Layer for buffer semiconductor device including microelectromechnical system (MEMS) device | Ching-Kai Shen, Wei-Chu Lin, Hung-Wei Liang, Jung-Kuo Tu | 2022-10-04 |
| 11434129 | Semiconductor structure and method for fabricating the same | Chun-Wen Cheng, Cheng-Yu Hsieh, Lee-Chuan Tseng, Shih-Chang Liu, Shih-Wei Lin | 2022-09-06 |
| 11292712 | Method of forming semiconductor device structure | Chun-Yin Tsai, Chia-Hua Chu, Chun-Wen Cheng | 2022-04-05 |
| 11289568 | Reduction of electric field enhanced moisture penetration by metal shielding | Chi-Yuan Shih, Kai-Fung Chang, Shih-Fen Huang, Wen-Chuan Tai, Yi Heng Tsai +9 more | 2022-03-29 |
| 11274037 | Dual micro-electro mechanical system and manufacturing method thereof | Yang-Che Chen, Victor Chiang Liang, Chen-Hua Lin, Chwen-Ming Liu, Huang-Wen Tseng | 2022-03-15 |
| 11276670 | Semiconductor device and manufacturing method of semiconductor device | Victor Chiang Liang, Jung-Kuo Tu, Ching-Kai Shen | 2022-03-15 |
| 11117796 | MEMS devices including MEMS dies and connectors thereto | Chun-Wen Cheng, Jung-Huei Peng, Shang-Ying Tsai, Hung-Chia Tsai | 2021-09-14 |
| 11107630 | Integration scheme for breakdown voltage enhancement of a piezoelectric metal-insulator-metal device | Anderson Lin, Chun-Ren Cheng, Chi-Yuan Shih, Shih-Fen Huang, Yi Heng Tsai +6 more | 2021-08-31 |
| 10961114 | Semiconductor structure and manufacturing method for the same | Ching-Kai Shen, Wei-Chu Lin, Hung-Wei Liang, Jung-Kuo Tu | 2021-03-30 |
| 10861929 | Electronic device including a capacitor | Kai-Fung Chang, Lien-Yao Tsai, Baohua Niu, Chi-Yuan Shih | 2020-12-08 |
| 10710871 | MEMS devices including MEMS dies and connectors thereto | Chun-Wen Cheng, Jung-Huei Peng, Shang-Ying Tsai, Hung-Chia Tsai | 2020-07-14 |