Issued Patents All Time
Showing 1–25 of 27 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12202724 | Micro electro mechanical system (MEMs) device having metal sealing on necking portion of vent hole | Ching-Kai Shen, Yi-Chuan Teng, Wei-Chu Lin, Hung-Wei Liang | 2025-01-21 |
| 12074110 | Method for manufacturing semiconductor device | Ching-Kai Shen, Yi-Chuan Teng, Wei-Chu Lin, Hung-Wei Liang | 2024-08-27 |
| 12017908 | Semiconductor structure and method for forming the same | Ching-Kai Shen, Wei-Cheng Shen, Yi-Chuan Teng | 2024-06-25 |
| 11851318 | MEMS device and method for making the same | Yi-Chuan Teng, Ching-Kai Shen, Wei-Cheng Shen, Xin-Hua Huang, Wei-Chu Lin | 2023-12-26 |
| 11807520 | Semiconductor structure and method for manufacturing thereof | Yi-Chuan Teng, Ching-Kai Shen | 2023-11-07 |
| 11772960 | Method of forming dielectric and metal sealing layers on capping structure of a MEMs device | Ching-Kai Shen, Yi-Chuan Teng, Wei-Chu Lin, Hung-Wei Liang | 2023-10-03 |
| 11516596 | MEMS device and manufacturing method thereof | Wei-Chu Lin, Yi-Chuan Teng | 2022-11-29 |
| 11462478 | Layer for buffer semiconductor device including microelectromechnical system (MEMS) device | Ching-Kai Shen, Yi-Chuan Teng, Wei-Chu Lin, Hung-Wei Liang | 2022-10-04 |
| 11276670 | Semiconductor device and manufacturing method of semiconductor device | Yi-Chuan Teng, Victor Chiang Liang, Ching-Kai Shen | 2022-03-15 |
| 11097941 | Method of fabricating semiconductor structure | Yi-Hsien Chang, Tzu-Heng Wu, Chun-Ren Cheng, Shih-Wei Lin | 2021-08-24 |
| 10961114 | Semiconductor structure and manufacturing method for the same | Ching-Kai Shen, Yi-Chuan Teng, Wei-Chu Lin, Hung-Wei Liang | 2021-03-30 |
| 10510912 | Image sensor device and method | Kuo-Chin Huang, Tzu-Jui Wang, Szu-Ying Chen, Dun-Nian Yaung, Jen-Cheng Liu +2 more | 2019-12-17 |
| 10273140 | Substrate structure, semiconductor structure and method for fabricating the same | Yi-Hsien Chang, Tzu-Heng Wu, Chun-Ren Cheng, Shih-Wei Lin | 2019-04-30 |
| 10269586 | Package structure and methods of forming same | Bruce C. S. Chou, Chih-Hsien Lin, Hsiang-Tai Lu, Tung-Hung Hsieh, Chen-Hua Lin +1 more | 2019-04-23 |
| 10164133 | Image sensor device and method | Kuo-Chin Huang, Tzu-Jui Wang, Szu-Ying Chen, Dun-Nian Yaung, Jen-Cheng Liu +2 more | 2018-12-25 |
| 9786628 | Air trench in packages incorporating hybrid bonding | Bruce C. S. Chou, Chen-Jong Wang, Ping-Yin Liu, Tsung-Te Chou, Xin-Hua Huang +4 more | 2017-10-10 |
| 9722109 | Image sensor device and method | Kuo-Chin Huang, Tzu-Jui Wang, Szu-Ying Chen, Dun-Nian Yaung, Jen-Cheng Liu +2 more | 2017-08-01 |
| 9561954 | Method of fabricating MEMS devices having a plurality of cavities | Shyh-Wei Cheng, Jui-Chun Weng, Hsi-Cheng Hsu, Chih-Yu Wang, Che-Jung Chu +1 more | 2017-02-07 |
| 9502396 | Air trench in packages incorporating hybrid bonding | Bruce C. S. Chou, Chen-Jong Wang, Ping-Yin Liu, Tsung-Te Chou, Xin-Hua Huang +4 more | 2016-11-22 |
| 9443796 | Air trench in packages incorporating hybrid bonding | Bruce C. S. Chou, Chen-Jong Wang, Ping-Yin Liu, Tsung-Te Chou, Xin-Hua Huang +4 more | 2016-09-13 |
| 9422155 | Capacitive sensors and methods for forming the same | Bruce C. S. Chou, Chen-Chih Fan | 2016-08-23 |
| 9318528 | Image sensor device and method | Kuo-Chin Huang, Tzu-Jui Wang, Szu-Ying Chen, Dun-Nian Yaung, Jen-Cheng Liu +2 more | 2016-04-19 |
| 9159852 | Image sensor device and method | Kuo-Chin Huang, Tzu-Jui Wang, Szu-Ying Chen, Dun-Nian Yaung, Jen-Cheng Liu +2 more | 2015-10-13 |
| 9056762 | Capacitive sensors and methods for forming the same | Bruce C. S. Chou, Chen-Chih Fan | 2015-06-16 |
| 8970023 | Package structure and methods of forming same | Bruce C. S. Chou, Chih-Hsien Lin, Hsiang-Tai Lu, Tung-Hung Hsieh, Chen-Hua Lin +1 more | 2015-03-03 |