Issued Patents All Time
Showing 1–25 of 91 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12334475 | 3D trench capacitor for integrated passive devices | Chung-Yi Yu, Yeong-Jyh Lin, Rei-Lin Chu | 2025-06-17 |
| 12289979 | Deposition system for high accuracy patterning | Ping-Yin Liu, Chia-Shiung Tsai, Yu-Hsing Chang, Yeong-Jyh Lin | 2025-04-29 |
| 12255062 | Integrate rinse module in hybrid bonding platform | Ping-Yin Liu, Hung-Hua Lin, Hsun-Chung Kuang, Yuan-Chih Hsieh, Lan-Lin Chao +2 more | 2025-03-18 |
| 12211727 | Simultaneous bonding approach for high quality wafer stacking | Ping-Yin Liu, Chang-Chen Tsao | 2025-01-28 |
| 12195017 | Redundant electronic control system and device | Xuefeng Chen, Zhimin Zhang | 2025-01-14 |
| 12148706 | Substrate loss reduction for semiconductor devices | Chung-Yi Yu, Kuei-Ming Chen | 2024-11-19 |
| 12139399 | Conductive bond structure to increase membrane sensitivity in MEMS device | Hung-Hua Lin, Chia-Ming Hung, Yuan-Chih Hsieh | 2024-11-12 |
| 12131111 | Method, apparatus and device for measuring semiconductor structure | Shih-Shin Wang | 2024-10-29 |
| 12118324 | Domain-specific language models | Li Zhang, Sanjiv Ranjan Das, Yue Zhao, Zhijiang He, Shenghua Yue +3 more | 2024-10-15 |
| 11984366 | Measurement device and method for semiconductor structure | — | 2024-05-14 |
| 11922002 | Notification display in message session | Cécile Boucheron, Ganna Isayeva, Kathy Q. Kong, Sharvari Nerurkar, Archil Vardidze +1 more | 2024-03-05 |
| 11862612 | 3D trench capacitor for integrated passive devices | Chung-Yi Yu, Yeong-Jyh Lin, Rei-Lin Chu | 2024-01-02 |
| 11854999 | Patterning a transparent wafer to form an alignment mark in the transparent wafer | Ping-Yin Liu | 2023-12-26 |
| 11851318 | MEMS device and method for making the same | Yi-Chuan Teng, Ching-Kai Shen, Jung-Kuo Tu, Wei-Cheng Shen, Wei-Chu Lin | 2023-12-26 |
| 11854795 | Integrate rinse module in hybrid bonding platform | Ping-Yin Liu, Hung-Hua Lin, Hsun-Chung Kuang, Yuan-Chih Hsieh, Lan-Lin Chao +2 more | 2023-12-26 |
| 11841791 | Code change request aggregation for a continuous integration pipeline | Wen Tao Zhang, Hong Jun Tu, Yiwen Huang, Yang Yang, YE CUI +3 more | 2023-12-12 |
| 11818944 | Deposition system for high accuracy patterning | Ping-Yin Liu, Chia-Shiung Tsai, Yu-Hsing Chang, Yeong-Jyh Lin | 2023-11-14 |
| 11742321 | Apparatus for bond wave propagation control | Kuan-Liang Liu, Kuo-Liang Lu, Ping-Yin Liu | 2023-08-29 |
| 11721637 | Patterning a transparent wafer to form an alignment mark in the transparent wafer | Ping-Yin Liu | 2023-08-08 |
| 11652058 | Substrate loss reduction for semiconductor devices | Chung-Yi Yu, Kuei-Ming Chen | 2023-05-16 |
| 11620041 | Reminder notifications for messages | Cécile Boucheron, Ganna Isayeva, Kathy Q. Kong, Sharvari Nerurkar, Archil Vardidze +1 more | 2023-04-04 |
| 11621186 | Simultaneous bonding approach for high quality wafer stacking applications | Ping-Yin Liu, Chang-Chen Tsao | 2023-04-04 |
| 11508562 | Low contamination chamber for surface activation | Ping-Yin Liu, Lee-Chuan Tseng, Lan-Lin Chao | 2022-11-22 |
| 11292715 | Conductive bond structure to increase membrane sensitivity in MEMS device | Hung-Hua Lin, Chia-Ming Hung, Yuan-Chih Hsieh | 2022-04-05 |
| 11282697 | Integrate rinse module in hybrid bonding platform | Ping-Yin Liu, Hung-Hua Lin, Hsun-Chung Kuang, Yuan-Chih Hsieh, Lan-Lin Chao +2 more | 2022-03-22 |