Issued Patents All Time
Showing 26–50 of 91 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11222849 | Substrate loss reduction for semiconductor devices | Chung-Yi Yu, Kuei-Ming Chen | 2022-01-11 |
| 11211362 | 3D trench capacitor for integrated passive devices | Chung-Yi Yu, Yeong-Jyh Lin, Rei-Lin Chu | 2021-12-28 |
| 11094575 | Simultaneous bonding approach for high quality wafer stacking applications | Ping-Yin Liu, Chang-Chen Tsao | 2021-08-17 |
| 11031369 | Apparatus for bond wave propagation control | Kuan-Liang Liu, Kuo-Liang Lu, Ping-Yin Liu | 2021-06-08 |
| 10962878 | Approach for ultra thin-film transfer and handling | Ping-Yin Liu, Chang-Ming Wu, Chia-Shiung Tsai | 2021-03-30 |
| 10685559 | Bluetooth remote controller | Wenbin Zhang, Huiping CHEN, Guangli Guo | 2020-06-16 |
| 10665449 | Integrate rinse module in hybrid bonding platform | Ping-Yin Liu, Hung-Hua Lin, Hsun-Chung Kuang, Yuan-Chih Hsieh, Lan-Lin Chao +2 more | 2020-05-26 |
| 10536692 | Picture prediction method and related apparatus | Hong-Jiang Zhang, Haitao Yang | 2020-01-14 |
| 10509312 | Approach for ultra thin-film transfer and handling | Ping-Yin Liu, Chang-Ming Wu, Chia-Shiung Tsai | 2019-12-17 |
| 10497667 | Apparatus for bond wave propagation control | Kuan-Liang Liu, Kuo-Liang Lu, Ping-Yin Liu | 2019-12-03 |
| 10492278 | Bluetooth controller | Wenbin Zhang, Huiping CHEN, Guangli Guo, Zhiguang PENG | 2019-11-26 |
| 10410892 | Method of semiconductor wafer bonding and system thereof | Kuan-Liang Lu, Yeur-Luen Tu | 2019-09-10 |
| 10354972 | Hybrid bonding systems and methods for semiconductor wafers | Ping-Yin Liu, Shih-Wei Lin, Lan-Lin Chao, Chia-Shiung Tsai | 2019-07-16 |
| 10283448 | Multiple metal layer semiconductor device and low temperature stacking method of fabricating the same | Ping-Yin Liu, Kai-Wen Cheng, Lan-Lin Chao, Chia-Shiung Tsai, Xiaomeng Chen | 2019-05-07 |
| 10219003 | Intra-frame predictive coding and decoding methods based on template matching, array scanning method and apparatus, and apparatus | Haitao Yang | 2019-02-26 |
| 10160638 | Method and apparatus for a semiconductor structure | Li-Cheng Chu, Ping-Yin Liu, Yuan-Chih Hsieh, Lan-Lin Chao, Chun-Wen Cheng | 2018-12-25 |
| 10128209 | Wafer bonding process and structure | Ping-Yin Liu, Lan-Lin Chao, Cheng-Tai Hsiao, Hsun-Chung Kuang | 2018-11-13 |
| 10103122 | Hybrid bonding systems and methods for semiconductor wafers | Ping-Yin Liu, Shih-Wei Lin, Lan-Lin Chao, Chia-Shiung Tsai | 2018-10-16 |
| 10049901 | Apparatus and method for wafer level bonding | Ping-Yin Liu, Yen-Chang Chu, Lan-Lin Chao, Yeur-Luen Tu, Ru-Liang Lee | 2018-08-14 |
| 10037968 | Alignment systems and wafer bonding systems and methods | Xiaomeng Chen, Ping-Yin Liu, Lan-Lin Chao | 2018-07-31 |
| 10013523 | Full-chip assessment of time-dependent dielectric breakdown | Valeriy Sukharev | 2018-07-03 |
| 9960129 | Hybrid bonding mechanisms for semiconductor wafers | Ping-Yin Liu, Szu-Ying Chen, Chen-Jong Wang, Chih-Hui Huang, Lan-Lin Chao +3 more | 2018-05-01 |
| 9953847 | Apparatus and method for cleaning | Ping-Yin Liu, Lan-Lin Chao | 2018-04-24 |
| 9917069 | Hybrid bonding system and cleaning method thereof | Ping-Yin Liu, Yeong-Jyh Lin, Chia-Shiung Tsai | 2018-03-13 |
| 9887155 | Multiple metal layer semiconductor device and low temperature stacking method of fabricating the same | Ping-Yin Liu, Kai-Wen Cheng, Lan-Lin Chao, Chia-Shiung Tsai, Xiaomeng Chen | 2018-02-06 |