Issued Patents All Time
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12386373 | Power supply circuit and control method thereof | — | 2025-08-12 |
| 11901885 | Pulse width modulation-based overcurrent protection circuit and operating method for the same | — | 2024-02-13 |
| 11750000 | Electronic device having USB power delivery function | Ya-Hsuan Sung, Leaf Chen | 2023-09-05 |
| 11716077 | Switch control circuit, universal serial bus control circuit, and method for controlling a power switch thereof | — | 2023-08-01 |
| 11569813 | USB signal output circuit and operation method thereof having reverse current prevention mechanism | Leaf Chen | 2023-01-31 |
| 10160638 | Method and apparatus for a semiconductor structure | Ping-Yin Liu, Xin-Hua Huang, Yuan-Chih Hsieh, Lan-Lin Chao, Chun-Wen Cheng | 2018-12-25 |
| 10142861 | Method and device for monitoring device-to-device communication and computer storage medium | Ying Huang, Sergio Parolari, Lin Chen, Yuqin Chen | 2018-11-27 |
| 10119909 | Biological sensing structures | Hung-Hua Lin, Ming-Tung Wu, Yuan-Chih Hsieh, Lan-Lin Chao, Chia-Shiung Tsai | 2018-11-06 |
| 9873610 | Multiple bonding in wafer level packaging | Chung-Hsien Lin, Chia-Hua Chu, Yuan-Chih Hsieh, Chun-Wen Cheng | 2018-01-23 |
| 9708179 | Method of improving getter efficiency by increasing superficial area | Yuan-Chih Hsieh, Hung-Hua Lin, Chih-Jen Chan, Lan-Lin Chao | 2017-07-18 |
| 9611141 | Self-removal anti-stiction coating for bonding process | Ping-Yin Liu, Hung-Hua Lin, Shang-Ying Tsai, Yuan-Chih Hsieh, Jung-Huei Peng +3 more | 2017-04-04 |
| 9472504 | Semiconductor having a high aspect ratio via | Yuan-Chih Hsieh, Ming-Tung Wu, Ping-Yin Liu, Lan-Lin Chao, Chia-Shiung Tsai | 2016-10-18 |
| 9377401 | Biological sensing structures | Hung-Hua Lin, Ming-Tung Wu, Yuan-Chih Hsieh, Lan-Lin Chao, Chia-Shiung Tsai | 2016-06-28 |
| 9242853 | Method of improving getter efficiency by increasing superficial area | Yuan-Chih Hsieh, Hung-Hua Lin, Chih-Jen Chan, Lan-Lin Chao | 2016-01-26 |
| 9099476 | Semiconductor having a high aspect ratio via | Yuan-Chih Hsieh, Ming-Tung Wu, Ping-Yin Liu, Lan-Lin Chao, Chia-Shiung Tsai | 2015-08-04 |
| 8905293 | Self-removal anti-stiction coating for bonding process | Ping-Yin Liu, Hung-Hua Lin, Shang-Ying Tsai, Yuan-Chih Hsieh, Jung-Huei Peng +3 more | 2014-12-09 |
| 8846129 | Biological sensing structures and methods of forming the same | Hung-Hua Lin, Ming-Tung Wu, Yuan-Chih Hsieh, Lan-Lin Chao, Chia-Shiung Tsai | 2014-09-30 |
| 8790946 | Methods of bonding caps for MEMS devices | Xin-Hua Huang, Ping-Yin Liu, Yuan-Chih Hsieh, Lan-Lin Chao, Chun-Wen Cheng +1 more | 2014-07-29 |
| 8633554 | MEMS device etch stop | Chia-Hua Chu, Yi Heng Tsai, Kai-Chih Liang, Chia-Pao Shu, Kuei-Sung Chang +2 more | 2014-01-21 |
| 8486744 | Multiple bonding in wafer level packaging | Chung-Hsien Lin, Chia-Hua Chu, Yuan-Chih Hsieh, Chun-Wen Cheng | 2013-07-16 |
| 8405169 | Handling layer for transparent substrate | Chun-Ren Cheng, Yi-Hsien Chang, Allen Timothy Chang, Ching-Ray Chen, Hung-Hua Lin +2 more | 2013-03-26 |
| 8368152 | MEMS device etch stop | Chia-Hua Chu, Yi Heng Tsai, Kai-Chih Liang, Chia-Pao Shu, Kuei-Sung Chang +2 more | 2013-02-05 |