Issued Patents All Time
Showing 1–25 of 87 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12412863 | Die attached leveling control by metal stopper bumps | Wei-Jhih Mao, Shang-Ying Tsai | 2025-09-09 |
| 12358783 | Wire-bond damper for shock absorption | Tsung-Lin Hsieh, Wei-Jhih Mao, Shang-Ying Tsai, Chun-Wen Cheng | 2025-07-15 |
| 12322722 | Die attached leveling control by metal stopper bumps | Wei-Jhih Mao, Shang-Ying Tsai | 2025-06-03 |
| 12297097 | Bypass structure | Eason Hsieh, Fei-Lung Lai | 2025-05-13 |
| 12234141 | Outgassing material coated cavity for a micro-electro mechanical system device and methods for forming the same | Tai-Bang An, Chun-Wen Cheng, Hung-Hua Lin | 2025-02-25 |
| 12191185 | Vacuum wafer chuck for manufacturing semiconductor devices | Chien-Fa Lee, Chin-Lin CHOU, Shang-Ying Tsai, Shou-Wen Kuo, Jiun-Rong Pai +2 more | 2025-01-07 |
| 12151932 | Microelectromechanical systems device having a mechanically robust anti-stiction/outgassing structure | Chun-Wen Cheng, Fei-Lung Lai, Shing-Chyang Pan, Yuan-Chih Hsieh, Yi-Ren Wang | 2024-11-26 |
| 12002780 | Package structure including a base and a lid disposed over the base and method of forming the package structure | — | 2024-06-04 |
| 11993510 | Composite spring structure to reinforce mechanical robustness of a MEMS device | Shang-Ying Tsai, Wei-Jhih Mao | 2024-05-28 |
| 11987494 | Wire-bond damper for shock absorption | Tsung-Lin Hsieh, Wei-Jhih Mao, Shang-Ying Tsai, Chun-Wen Cheng | 2024-05-21 |
| 11970387 | Micro-electro mechanical system device containing a bump stopper and methods for forming the same | Chun-Wen Cheng, Chi-Hang Chin | 2024-04-30 |
| 11965731 | Package structure and measurement method for the package structure | — | 2024-04-23 |
| 11923331 | Die attached leveling control by metal stopper bumps | Wei-Jhih Mao, Shang-Ying Tsai | 2024-03-05 |
| 11827513 | Outgassing material coated cavity for a micro-electro mechanical system device and methods for forming the same | Tai-Bang An, Chun-Wen Cheng, Hung-Hua Lin | 2023-11-28 |
| 11814283 | Microelectromechanical systems device having a mechanically robust anti-stiction/outgassing structure | Chun-Wen Cheng, Fei-Lung Lai, Shing-Chyang Pan, Yuan-Chih Hsieh, Yi-Ren Wang | 2023-11-14 |
| 11736037 | MEMS structure and method of forming same | Yi Heng Tsai, Chia-Hua Chu | 2023-08-22 |
| 11713242 | MEMS device with dummy-area utilization for pressure enhancement | Chun-Wen Cheng, Fei-Lung Lai, Shang-Ying Tsai | 2023-08-01 |
| 11661333 | Semiconductor structure and manufacturing method thereof | Wei-Jhih Mao, Shang-Ying Tsai, Chun-Wen Cheng | 2023-05-30 |
| 11591211 | Semiconductive structure and manufacturing method thereof | Yen-Cheng Liu, Cheng-Yu Hsieh, Shang-Ying Tsai | 2023-02-28 |
| 11542151 | MEMS apparatus with anti-stiction layer | Fei-Lung Lai, Shang-Ying Tsai, Cheng-Yu Hsieh | 2023-01-03 |
| 11530130 | Method of making ohmic contact on low doped bulk silicon for optical alignment | Chia-Hua Chu, Shang-Ying Tsai | 2022-12-20 |
| 11508608 | Vacuum wafer chuck for manufacturing semiconductor devices | Chien-Fa Lee, Chin-Lin CHOU, Shang-Ying Tsai, Shou-Wen Kuo, Jiun-Rong Pai +2 more | 2022-11-22 |
| 11485631 | Method of making ohmic contact on low doped bulk silicon for optical alignment | Chia-Hua Chu, Shang-Ying Tsai | 2022-11-01 |
| 11420866 | Composite spring structure to reinforce mechanical robustness of a MEMS device | Shang-Ying Tsai, Wei-Jhih Mao | 2022-08-23 |
| 11279611 | Micro-electro mechanical system device containing a bump stopper and methods for forming the same | Chun-Wen Cheng, Chi-Hang Chin | 2022-03-22 |