Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12412863 | Die attached leveling control by metal stopper bumps | Kuei-Sung Chang, Shang-Ying Tsai | 2025-09-09 |
| 12358783 | Wire-bond damper for shock absorption | Tsung-Lin Hsieh, Shang-Ying Tsai, Kuei-Sung Chang, Chun-Wen Cheng | 2025-07-15 |
| 12322722 | Die attached leveling control by metal stopper bumps | Kuei-Sung Chang, Shang-Ying Tsai | 2025-06-03 |
| 11993510 | Composite spring structure to reinforce mechanical robustness of a MEMS device | Kuei-Sung Chang, Shang-Ying Tsai | 2024-05-28 |
| 11987494 | Wire-bond damper for shock absorption | Tsung-Lin Hsieh, Shang-Ying Tsai, Kuei-Sung Chang, Chun-Wen Cheng | 2024-05-21 |
| 11923331 | Die attached leveling control by metal stopper bumps | Kuei-Sung Chang, Shang-Ying Tsai | 2024-03-05 |
| 11661333 | Semiconductor structure and manufacturing method thereof | Shang-Ying Tsai, Kuei-Sung Chang, Chun-Wen Cheng | 2023-05-30 |
| 11420866 | Composite spring structure to reinforce mechanical robustness of a MEMS device | Kuei-Sung Chang, Shang-Ying Tsai | 2022-08-23 |
| 11235969 | CMOS-MEMS integration with through-chip via process | Chun-Wen Cheng, Chia-Hua Chu, Wen Cheng Kuo | 2022-02-01 |