Issued Patents All Time
Showing 1–25 of 244 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12421103 | Microelectromechanical system device | Chen-Hsiung Yang, Chia-Hua Chu, En-Chan Chen | 2025-09-23 |
| 12391545 | Semiconductor device and method for fabricating the same | Yi-Chuan Teng, Cheng-Yu Hsieh, Lee-Chuan Tseng, Shih-Chang Liu, Shih-Wei Lin | 2025-08-19 |
| 12376401 | Methods of forming optical modules | Jung-Huei Peng, Yi-Chien Wu | 2025-07-29 |
| 12358783 | Wire-bond damper for shock absorption | Tsung-Lin Hsieh, Wei-Jhih Mao, Shang-Ying Tsai, Kuei-Sung Chang | 2025-07-15 |
| 12234141 | Outgassing material coated cavity for a micro-electro mechanical system device and methods for forming the same | Kuei-Sung Chang, Tai-Bang An, Hung-Hua Lin | 2025-02-25 |
| 12216077 | BioFET device having a metal crown structure as a sensing layer disposed on an oxide layer formed under a channel region of a transistor | Yi-Shao Liu, Fei-Lung Lai | 2025-02-04 |
| 12219320 | MEMS device with enhanced membrane structure and method of forming the same | Chun-Yin Tsai, Chia-Hua Chu | 2025-02-04 |
| 12191185 | Vacuum wafer chuck for manufacturing semiconductor devices | Chien-Fa Lee, Chin-Lin CHOU, Shang-Ying Tsai, Shou-Wen Kuo, Kuei-Sung Chang +2 more | 2025-01-07 |
| 12151932 | Microelectromechanical systems device having a mechanically robust anti-stiction/outgassing structure | Kuei-Sung Chang, Fei-Lung Lai, Shing-Chyang Pan, Yuan-Chih Hsieh, Yi-Ren Wang | 2024-11-26 |
| 12134555 | Method and structure for CMOS-MEMS thin film encapsulation | Yu-Chia Liu, Chia-Hua Chu | 2024-11-05 |
| 12054383 | MEMS microphone and MEMS accelerometer on a single substrate | Chia-Hua Chu, Chun-Yin Tsai, Wen Cheng Kuo | 2024-08-06 |
| 12043538 | Semiconductor device structure with movable membrane | Yi-Chuan Teng, Chun-Yin Tsai, Chia-Hua Chu | 2024-07-23 |
| 11987891 | Sensor in an internet-of-things | Ming-Ta Lei, Chia-Hua Chu, Hsin-Chih Chiang, Tung-Tsun Chen | 2024-05-21 |
| 11987494 | Wire-bond damper for shock absorption | Tsung-Lin Hsieh, Wei-Jhih Mao, Shang-Ying Tsai, Kuei-Sung Chang | 2024-05-21 |
| 11970387 | Micro-electro mechanical system device containing a bump stopper and methods for forming the same | Chi-Hang Chin, Kuei-Sung Chang | 2024-04-30 |
| 11827513 | Outgassing material coated cavity for a micro-electro mechanical system device and methods for forming the same | Kuei-Sung Chang, Tai-Bang An, Hung-Hua Lin | 2023-11-28 |
| 11814283 | Microelectromechanical systems device having a mechanically robust anti-stiction/outgassing structure | Kuei-Sung Chang, Fei-Lung Lai, Shing-Chyang Pan, Yuan-Chih Hsieh, Yi-Ren Wang | 2023-11-14 |
| 11807521 | Support structure for MEMS device with particle filter | Chia-Hua Chu, Wen Cheng Kuo | 2023-11-07 |
| 11768170 | Biochip having a channel | Yi-Shao Liu, Chun-Ren Cheng | 2023-09-26 |
| 11750980 | MEMS device with enhanced membrane structure and method of forming the same | Chun-Yin Tsai, Chia-Hua Chu | 2023-09-05 |
| 11713242 | MEMS device with dummy-area utilization for pressure enhancement | Fei-Lung Lai, Kuei-Sung Chang, Shang-Ying Tsai | 2023-08-01 |
| 11703475 | Method of using integrated electro-microfluidic probe card | Yi-Shao Liu, Fei-Lung Lai, Chun-Ren Cheng | 2023-07-18 |
| 11678133 | Structure for integrated microphone | Jung-Huei Peng, Chia-Hua Chu, Chin-Yi Cho, Li-Min Hung, Yao-Te Huang | 2023-06-13 |
| 11667517 | Method and structure for CMOS-MEMS thin film encapsulation | Yu-Chia Liu, Chia-Hua Chu | 2023-06-06 |
| 11661333 | Semiconductor structure and manufacturing method thereof | Wei-Jhih Mao, Shang-Ying Tsai, Kuei-Sung Chang | 2023-05-30 |