Issued Patents All Time
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12421103 | Microelectromechanical system device | Chun-Wen Cheng, Chia-Hua Chu, En-Chan Chen | 2025-09-23 |
| 11577954 | Method for forming semiconductor device | Chun-Wen Cheng, Chia-Hua Chu, En-Chan Chen | 2023-02-14 |
| 11206493 | Sensor device and manufacturing method thereof | Chun-Wen Cheng, Chia-Hua Chu, En-Chan Chen | 2021-12-21 |
| 11186481 | Sensor device and manufacturing method thereof | Chun-Wen Cheng, Jiou-Kang Lee | 2021-11-30 |
| 10865099 | MEMS device and method for forming the same | Chun-Wen Cheng, Chia-Hua Chu, En-Chan Chen | 2020-12-15 |
| 10087071 | Semiconductor structure and manufacturing method thereof | Tzu-Heng Wu, Chia-Hua Chu, Yi Heng Tsai, Cheng San Chou | 2018-10-02 |
| 9550667 | Semiconductor structure and manufacturing method thereof | Cheng San Chou, Chin-Min Lin | 2017-01-24 |
| 7582511 | Method for wafer level chip scale packaging with passive components integrated into packaging structure | — | 2009-09-01 |
| 7566574 | Method of performing a double-sided process | — | 2009-07-28 |
| 7531457 | Method of fabricating suspended structure | Yu-Fu Kang | 2009-05-12 |
| 7505118 | Wafer carrier | — | 2009-03-17 |
| 7465601 | Method of forming suspended structure | Yu-Fu Kang | 2008-12-16 |
| 7410835 | Method for fabricating semiconductor package with short-prevented lead frame | Jui-Hsiang Hung, Chin-Teng Hsu, Chih-Jen Yang | 2008-08-12 |
| 7306955 | Method of performing a double-sided process | — | 2007-12-11 |
| 7297610 | Method of segmenting a wafer | — | 2007-11-20 |
| 7256128 | Method of double-sided etching | — | 2007-08-14 |
| 7192842 | Method for bonding wafers | Shih-Feng Shao, Hsin-Ya Peng | 2007-03-20 |
| 7045463 | Method of etching cavities having different aspect ratios | — | 2006-05-16 |
| 7008821 | Method of forming a wafer backside interconnecting wire | Shih-Feng Shao, Hsin-Ya Peng | 2006-03-07 |