Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8912555 | Semiconductor light-emitting device | Heng Liu, Jinn-Kong Sheu | 2014-12-16 |
| 7622334 | Wafer-level packaging cutting method capable of protecting contact pads | Chun-Wei Tsai | 2009-11-24 |
| 7598125 | Method for wafer level packaging and fabricating cap structures | Ming-Yen Chiu | 2009-10-06 |
| 7510947 | Method for wafer level packaging and fabricating cap structures | Ming-Yen Chiu | 2009-03-31 |
| 7192842 | Method for bonding wafers | Hsin-Ya Peng, Chen-Hsiung Yang | 2007-03-20 |
| 7008821 | Method of forming a wafer backside interconnecting wire | Chen-Hsiung Yang, Hsin-Ya Peng | 2006-03-07 |