Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7192842 | Method for bonding wafers | Shih-Feng Shao, Chen-Hsiung Yang | 2007-03-20 |
| 7008821 | Method of forming a wafer backside interconnecting wire | Shih-Feng Shao, Chen-Hsiung Yang | 2006-03-07 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7192842 | Method for bonding wafers | Shih-Feng Shao, Chen-Hsiung Yang | 2007-03-20 |
| 7008821 | Method of forming a wafer backside interconnecting wire | Shih-Feng Shao, Chen-Hsiung Yang | 2006-03-07 |