Issued Patents All Time
Showing 1–25 of 41 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12334406 | Package with tilted interface between device die and encapsulating material | Hsin-Chieh Huang, Ching Fu Chang | 2025-06-17 |
| 12074066 | Integrated circuit component with conductive terminals of different dimensions and package structure having the same | — | 2024-08-27 |
| 11901303 | Integrated fan-out package | Ching Fu Chang, Hsin-Chieh Huang | 2024-02-13 |
| 11854993 | Integrated fan-out package | Ching Fu Chang, Hsin-Chieh Huang | 2023-12-26 |
| 11804475 | Semiconductor package for thermal dissipation | Chen-Hua Yu, Shin-Puu Jeng, Der-Chyang Yeh, Hsien-Wei Chen, Cheng-Chieh Hsieh | 2023-10-31 |
| 11594520 | Semiconductor package for thermal dissipation | Chen-Hua Yu, Shin-Puu Jeng, Der-Chyang Yeh, Hsien-Wei Chen, Cheng-Chieh Hsieh | 2023-02-28 |
| 11417569 | Package structure having integrated circuit component with conductive terminals of different dimensions | — | 2022-08-16 |
| 11362037 | Integrated fan-out package | Ching Fu Chang, Hsin-Chieh Huang | 2022-06-14 |
| 11322419 | Package with tilted interface between device die and encapsulating material | Hsin-Chieh Huang, Ching Fu Chang | 2022-05-03 |
| 11282796 | Integrated fan-out package and method of fabricating the same | Ching Fu Chang, Hsin-Chieh Huang | 2022-03-22 |
| 10879185 | Package structure with bump | Hsin-Chieh Huang, Ching Fu Chang | 2020-12-29 |
| 10879201 | Semiconductor package for wafer level packaging and manufacturing method thereof | Shou-Yi Wang, Tsung-Shu Lin | 2020-12-29 |
| 10811389 | Semiconductor package for thermal dissipation | Chen-Hua Yu, Shin-Puu Jeng, Der-Chyang Yeh, Hsien-Wei Chen, Cheng-Chieh Hsieh | 2020-10-20 |
| 10790235 | Integrated fan-out package and method of fabricating the same | Ching Fu Chang, Hsin-Chieh Huang | 2020-09-29 |
| 10770402 | Integrated fan-out package | Ching Fu Chang, Hsin-Chieh Huang | 2020-09-08 |
| 10756038 | Semiconductor package and manufacturing method thereof | Shou-Yi Wang, Tsung-Shu Lin | 2020-08-25 |
| 10734299 | Package with tilted interface between device die and encapsulating material | Hsin-Chieh Huang, Ching Fu Chang | 2020-08-04 |
| 10636757 | Integrated circuit component package and method of fabricating the same | Ching-Jung Yang | 2020-04-28 |
| 10515899 | Package structure with bump | Hsin-Chieh Huang, Ching Fu Chang | 2019-12-24 |
| 10276506 | Integrated fan-out package | Ching Fu Chang, Hsin-Chieh Huang | 2019-04-30 |
| 10170430 | Integrated fan-out package and method of fabricating the same | Ching Fu Chang, Hsin-Chieh Huang | 2019-01-01 |
| 10163861 | Semiconductor package for thermal dissipation | Chen-Hua Yu, Shin-Puu Jeng, Der-Chyang Yeh, Hsien-Wei Chen, Cheng-Chieh Hsieh | 2018-12-25 |
| 10163745 | Package with tilted interface between device die and encapsulating material | Hsin-Chieh Huang, Ching Fu Chang | 2018-12-25 |
| 10109589 | Integrated fan-out package and method of fabricating the same | Ching Fu Chang, Hsin-Chieh Huang | 2018-10-23 |
| 10068867 | Post-passivation interconnect structure and methods thereof | Chien-Chia Chiu | 2018-09-04 |