Issued Patents All Time
Showing 1–25 of 108 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12342565 | Semiconductor devices and methods of manufacturing thereof | Chia-Cheng Chao, Yu-Wen Wang | 2025-06-24 |
| 12334406 | Package with tilted interface between device die and encapsulating material | Ming-Yen Chiu, Ching Fu Chang | 2025-06-17 |
| 12261074 | Info structure with copper pillar having reversed profile | Hsi-Kuei Cheng, Ching Fu Chang, Chih-Kang Han | 2025-03-25 |
| 12237380 | Semiconductor device and method of forming the same | Chia-Ming Chang, Chi-Wen Liu, Cheng-Chien Li | 2025-02-25 |
| 12224209 | Semiconductor device and manufacturing method thereof | Chia-Cheng Chao, Yu-Wen Wang | 2025-02-11 |
| 12205822 | Nanostructure and manufacturing method thereof | Chia-Cheng Chao, Yu-Wen Wang | 2025-01-21 |
| 12131911 | CMP process and methods thereof | Che-Lun Chang, Pin-Chuan Su, Ming-Yuan Wu, Tzu kai Lin, Yu-Wen Wang +1 more | 2024-10-29 |
| 11990454 | Package structure and method of forming the same | Hsi-Kuei Cheng, Ching Fu Chang, Chih-Kang Han | 2024-05-21 |
| 11984342 | Info structure with copper pillar having reversed profile | Hsi-Kuei Cheng, Ching Fu Chang, Chih-Kang Han | 2024-05-14 |
| 11948881 | Semiconductor structure | Hsi-Kuei Cheng, Chih-Kang Han, Ching Fu Chang | 2024-04-02 |
| 11901303 | Integrated fan-out package | Ming-Yen Chiu, Ching Fu Chang | 2024-02-13 |
| 11854993 | Integrated fan-out package | Ming-Yen Chiu, Ching Fu Chang | 2023-12-26 |
| 11749724 | Semiconductor device and method of forming the same | Chia-Ming Chang, Chi-Wen Liu, Cheng-Chien Li | 2023-09-05 |
| D984513 | Optical lens | Sheng-Jung Lin, Shun-Wen Teng | 2023-04-25 |
| D984512 | Optical lens | Sheng-Jung Lin, Shun-Wen Teng | 2023-04-25 |
| 11618728 | Ionic liquid electrolyte | Hsisheng Teng, I-wen Sun, Yung-Che Yen, Jui-Cheng Chang | 2023-04-04 |
| 11616133 | Fin field-effect transistor device and method | Che-Lun Chang, Shiao-Shin Cheng, Ji-Yin Tsai, Yu-Lin Tsai, Ming-Yuan Wu +4 more | 2023-03-28 |
| 11387109 | CMP process and methods thereof | Che-Lun Chang, Pin-Chuan Su, Ming-Yuan Wu, Tzu kai Lin, Yu-Wen Wang +1 more | 2022-07-12 |
| 11362037 | Integrated fan-out package | Ming-Yen Chiu, Ching Fu Chang | 2022-06-14 |
| 11322419 | Package with tilted interface between device die and encapsulating material | Ming-Yen Chiu, Ching Fu Chang | 2022-05-03 |
| 11316030 | Fin field-effect transistor device and method | Che-Lun Chang, Shiao-Shin Cheng, Ji-Yin Tsai, Yu-Lin Tsai, Ming-Yuan Wu +4 more | 2022-04-26 |
| 11282796 | Integrated fan-out package and method of fabricating the same | Ming-Yen Chiu, Ching Fu Chang | 2022-03-22 |
| 11195867 | High dielectric constant dielectric layer forming method, image sensor device, and manufacturing method thereof | Tsung-Han Tsai, Horng-Huei Tseng, Chun-Hao Chou, Kuo-Cheng Lee, Yung-Lung Hsu +1 more | 2021-12-07 |
| 11143382 | Optical lens structure | Sheng-Jung Lin, Shun-Wen Teng | 2021-10-12 |
| 11069614 | Semiconductor package structure | Hsi-Kuei Cheng, Chih-Kang Han, Ching Fu Chang | 2021-07-20 |