Issued Patents All Time
Showing 1–25 of 31 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12334406 | Package with tilted interface between device die and encapsulating material | Ming-Yen Chiu, Hsin-Chieh Huang | 2025-06-17 |
| 12261074 | Info structure with copper pillar having reversed profile | Hsi-Kuei Cheng, Chih-Kang Han, Hsin-Chieh Huang | 2025-03-25 |
| 11990454 | Package structure and method of forming the same | Hsi-Kuei Cheng, Chih-Kang Han, Hsin-Chieh Huang | 2024-05-21 |
| 11984342 | Info structure with copper pillar having reversed profile | Hsi-Kuei Cheng, Chih-Kang Han, Hsin-Chieh Huang | 2024-05-14 |
| 11948881 | Semiconductor structure | Hsi-Kuei Cheng, Chih-Kang Han, Hsin-Chieh Huang | 2024-04-02 |
| 11901303 | Integrated fan-out package | Ming-Yen Chiu, Hsin-Chieh Huang | 2024-02-13 |
| 11854993 | Integrated fan-out package | Ming-Yen Chiu, Hsin-Chieh Huang | 2023-12-26 |
| 11362037 | Integrated fan-out package | Ming-Yen Chiu, Hsin-Chieh Huang | 2022-06-14 |
| 11322419 | Package with tilted interface between device die and encapsulating material | Ming-Yen Chiu, Hsin-Chieh Huang | 2022-05-03 |
| 11282796 | Integrated fan-out package and method of fabricating the same | Ming-Yen Chiu, Hsin-Chieh Huang | 2022-03-22 |
| 11069614 | Semiconductor package structure | Hsi-Kuei Cheng, Chih-Kang Han, Hsin-Chieh Huang | 2021-07-20 |
| 10950478 | Info structure with copper pillar having reversed profile | Hsi-Kuei Cheng, Chih-Kang Han, Hsin-Chieh Huang | 2021-03-16 |
| 10879185 | Package structure with bump | Ming-Yen Chiu, Hsin-Chieh Huang | 2020-12-29 |
| 10867973 | Package structure and method of forming the same | Hsi-Kuei Cheng, Chih-Kang Han, Hsin-Chieh Huang | 2020-12-15 |
| 10790235 | Integrated fan-out package and method of fabricating the same | Ming-Yen Chiu, Hsin-Chieh Huang | 2020-09-29 |
| 10770402 | Integrated fan-out package | Ming-Yen Chiu, Hsin-Chieh Huang | 2020-09-08 |
| 10734299 | Package with tilted interface between device die and encapsulating material | Ming-Yen Chiu, Hsin-Chieh Huang | 2020-08-04 |
| 10692809 | Manufacturing method for semiconductor structure | Hsi-Kuei Cheng, Chih-Kang Han, Hsin-Chieh Huang | 2020-06-23 |
| 10529697 | Package structure and method of forming the same | Hsi-Kuei Cheng, Chih-Kang Han, Hsin-Chieh Huang | 2020-01-07 |
| 10515899 | Package structure with bump | Ming-Yen Chiu, Hsin-Chieh Huang | 2019-12-24 |
| 10290530 | Info structure with copper pillar having reversed profile | Hsi-Kuei Cheng, Chih-Kang Han, Hsin-Chieh Huang | 2019-05-14 |
| 10276506 | Integrated fan-out package | Ming-Yen Chiu, Hsin-Chieh Huang | 2019-04-30 |
| 10170430 | Integrated fan-out package and method of fabricating the same | Ming-Yen Chiu, Hsin-Chieh Huang | 2019-01-01 |
| 10163745 | Package with tilted interface between device die and encapsulating material | Ming-Yen Chiu, Hsin-Chieh Huang | 2018-12-25 |
| 10128182 | Semiconductor package structure and manufacturing method thereof | Hsi-Kuei Cheng, Chih-Kang Han, Hsin-Chieh Huang | 2018-11-13 |