Issued Patents All Time
Showing 26–41 of 41 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10068844 | Integrated fan-out structure and method of forming | Hsien-Wei Chen | 2018-09-04 |
| 10037961 | Integrated fan-out package and method of fabricating the same | Ching Fu Chang, Hsin-Chieh Huang | 2018-07-31 |
| 9941216 | Conductive pattern and integrated fan-out package having the same | Ching Fu Chang, Chien-Chia Chiu, Hsin-Chieh Huang, Tsung-Shu Lin, Pei-Ti Yu | 2018-04-10 |
| 9922895 | Package with tilted interface between device die and encapsulating material | Hsin-Chieh Huang, Ching Fu Chang | 2018-03-20 |
| 9837359 | Integrated fan-out package and method of fabricating the same | Ching Fu Chang, Hsin-Chieh Huang | 2017-12-05 |
| 9818711 | Post-passivation interconnect structure and methods thereof | Chien-Chia Chiu | 2017-11-14 |
| 9754928 | SMD, IPD, and/or wire mount in a package | Hsien-Wei Chen | 2017-09-05 |
| 9461020 | Semiconductor package including an embedded surface mount device and method of forming the same | Der-Chyang Yeh, Hsien-Wei Chen, Ying-Ju Chen | 2016-10-04 |
| 9449947 | Semiconductor package for thermal dissipation | Chen-Hua Yu, Shin-Puu Jeng, Der-Chyang Yeh, Hsien-Wei Chen, Cheng-Chieh Hsieh | 2016-09-20 |
| 9196586 | Semiconductor package including an embedded surface mount device and method of forming the same | Hsien-Wei Chen, Ying-Ju Chen, Der-Chyang Yeh | 2015-11-24 |
| 8786054 | Structure for integrated circuit alignment | Yu-Chyi Harn, Sophia Wang, Chun-Hung Lin, Hsien-Wei Chen | 2014-07-22 |
| 8368180 | Scribe line metal structure | Chen-Hua Yu, Shin-Puu Jeng, Hao-Yi Tsai, Shang-Yun Hou, Hsien-Wei Chen | 2013-02-05 |
| 8174124 | Dummy pattern in wafer backside routing | Hsien-Wei Chen, Ming-Fa Chen, Shin-Puu Jeng | 2012-05-08 |
| 7598125 | Method for wafer level packaging and fabricating cap structures | Shih-Feng Shao | 2009-10-06 |
| 7510947 | Method for wafer level packaging and fabricating cap structures | Shih-Feng Shao | 2009-03-31 |
| 7393774 | Method of fabricating microconnectors | — | 2008-07-01 |