Issued Patents All Time
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12205866 | Semiconductor device | Li-Han Hsu | 2025-01-21 |
| 12191224 | Semiconductor package and manufacturing method thereof | Wei-Chih Lai, Chen-Hua Yu, Der-Chyang Yeh, Cheng-Hsien Hsieh, Li-Han Hsu +3 more | 2025-01-07 |
| 12125757 | Semiconductor package with stiffener structure and method forming the same | Wensen Hung, Yu-Ling Tsai, Tsung-Yu Chen | 2024-10-22 |
| 11955439 | Semiconductor package with redistribution structure and manufacturing method thereof | Wei-Cheng Wu, Cheng-Hsien Hsieh, Li-Han Hsu, Meng-Tsan Lee, Tsung-Shu Lin | 2024-04-09 |
| 11721602 | Semiconductor package with stiffener structure | Wensen Hung, Yu-Ling Tsai, Tsung-Yu Chen | 2023-08-08 |
| 11581268 | Semiconductor package with redistribution structure and manufacturing method thereof | Wei-Cheng Wu, Cheng-Hsien Hsieh, Li-Han Hsu, Meng-Tsan Lee, Tsung-Shu Lin | 2023-02-14 |
| 11515229 | Semiconductor package and manufacturing method thereof | Wei-Chih Lai, Chen-Hua Yu, Der-Chyang Yeh, Cheng-Hsien Hsieh, Li-Han Hsu +3 more | 2022-11-29 |
| 11195802 | Semiconductor package including shielding plate in redistribution structure, semiconductor package including conductive via in redistribution structure, and manufacturing method thereof | Wei-Cheng Wu, Cheng-Hsien Hsieh, Li-Han Hsu, Meng-Tsan Lee, Tsung-Shu Lin | 2021-12-07 |
| 11031352 | Routing design of dummy metal cap and redistribution line | Chen-Hua Yu, Hsien-Wei Chen, Meng-Tsan Lee, Tsung-Shu Lin, Wei-Cheng Wu +1 more | 2021-06-08 |
| 10971425 | Semiconductor device | Li-Han Hsu | 2021-04-06 |
| 10354961 | Routing design of dummy metal cap and redistribution line | Chen-Hua Yu, Hsien-Wei Chen, Meng-Tsan Lee, Tsung-Shu Lin, Wei-Cheng Wu +1 more | 2019-07-16 |
| 10068867 | Post-passivation interconnect structure and methods thereof | Ming-Yen Chiu | 2018-09-04 |
| 9972581 | Routing design of dummy metal cap and redistribution line | Chen-Hua Yu, Hsien-Wei Chen, Meng-Tsan Lee, Tsung-Shu Lin, Wei-Cheng Wu +1 more | 2018-05-15 |
| 9941216 | Conductive pattern and integrated fan-out package having the same | Ming-Yen Chiu, Ching Fu Chang, Hsin-Chieh Huang, Tsung-Shu Lin, Pei-Ti Yu | 2018-04-10 |
| 9818711 | Post-passivation interconnect structure and methods thereof | Ming-Yen Chiu | 2017-11-14 |
| 9748212 | Shadow pad for post-passivation interconnect structures | Shih-Wei Liang, Bor-Rung Su, Chang-Pin Huang, Hsien-Ming Tu, Chun-Hung Lin +1 more | 2017-08-29 |
| 8557631 | Interposer wafer bonding method and apparatus | Chen-Hua Yu, Cheng-Chieh Hsieh | 2013-10-15 |
| 6614172 | High efficiency white light emitting diode | Chiu-Ling Chen, Kwang K. Shih | 2003-09-02 |
| 6373875 | Semiconductor laser structure with an increased catastrophic optical damage level | Yuan-Chen Yu, Jin-Kuo Ho | 2002-04-16 |