Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11848233 | Semiconductor package and manufacturing method thereof | Po-Yuan Teng, De-Yuan Lu, Hao-Yi Tsai, Tin-Hao Kuo, Tzung-Hui Lee +1 more | 2023-12-19 |
| 11289373 | Semiconductor package and manufacturing method thereof | Po-Yuan Teng, De-Yuan Lu, Hao-Yi Tsai, Tin-Hao Kuo, Tzung-Hui Lee +1 more | 2022-03-29 |
| 10700033 | Packaging device and method of making the same | Chang-Chia Huang, Tsung-Shu Lin, Ming-Da Cheng, Wen-Hsiung Lu | 2020-06-30 |
| 10050001 | Packaging device and method of making the same | Chang-Chia Huang, Tsung-Shu Lin, Ming-Da Cheng, Wen-Hsiung Lu | 2018-08-14 |
| 9887144 | Ring structure for chip packaging | Wen-Yi Lin, Yu-Chih Liu, Ming-Chih Yew, Tsung-Shu Lin, Jing Ruei Lu +1 more | 2018-02-06 |
| 9748212 | Shadow pad for post-passivation interconnect structures | Shih-Wei Liang, Chang-Pin Huang, Chien-Chia Chiu, Hsien-Ming Tu, Chun-Hung Lin +1 more | 2017-08-29 |
| 9449933 | Packaging device and method of making the same | Chang-Chia Huang, Tsung-Shu Lin, Ming-Da Cheng, Wen-Hsiung Lu | 2016-09-20 |