Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431400 | Packages with enlarged through-vias in encapsulant | Hung-Jui Kuo, Tai-Min Chang, Hui-Jung Tsai, Ming-Tan Lee | 2025-09-30 |
| 12353134 | Photoresist system and method | Hung-Jui Kuo, Chen-Hua Yu, Ming-Tan Lee | 2025-07-08 |
| 11848233 | Semiconductor package and manufacturing method thereof | Po-Yuan Teng, Bor-Rung Su, Hao-Yi Tsai, Tin-Hao Kuo, Tzung-Hui Lee +1 more | 2023-12-19 |
| 11841618 | Photoresist system and method | Hung-Jui Kuo, Chen-Hua Yu, Ming-Tan Lee | 2023-12-12 |
| 11823969 | Packages with enlarged through-vias in encapsulant | Hung-Jui Kuo, Tai-Min Chang, Hui-Jung Tsai, Ming-Tan Lee | 2023-11-21 |
| 11515224 | Packages with enlarged through-vias in encapsulant | Hung-Jui Kuo, Tai-Min Chang, Hui-Jung Tsai, Ming-Tan Lee | 2022-11-29 |
| 11289373 | Semiconductor package and manufacturing method thereof | Po-Yuan Teng, Bor-Rung Su, Hao-Yi Tsai, Tin-Hao Kuo, Tzung-Hui Lee +1 more | 2022-03-29 |
| 11215929 | Photoresist system and method | Hung-Jui Kuo, Chen-Hua Yu, Ming-Tan Lee | 2022-01-04 |
| 10861710 | Methods of manufacturing semiconductor devices | Hung-Jui Kuo, Ming-Tan Lee, Chen-Cheng Kuo | 2020-12-08 |
| 9449931 | Pillar bumps and process for making same | Cheng-Chung Lin, Chung-Shi Liu, Meng-Wei Chou, Kuo-Cheng Lin, Wen-Hsiung Lu +2 more | 2016-09-20 |
| 9397080 | Package on package devices and methods of packaging semiconductor dies | Chun-Lei Hsu, Yu-Feng Chen, Ming-Che Ho, Chung-Shi Liu | 2016-07-19 |
| 8981559 | Package on package devices and methods of packaging semiconductor dies | Chun-Lei Hsu, Chung-Shi Liu, Ming-Che Ho, Yu-Feng Chen | 2015-03-17 |
| 8823166 | Pillar bumps and process for making same | Cheng-Chung Lin, Chung-Shi Liu, Meng-Wei Chou, Kuo-Cheng Lin, Wen-Hsiung Lu +2 more | 2014-09-02 |
| 7026580 | Adjustable exhaust flow for thermal uniformity | Yao-Hwan Kao, Jia-Sheng Lee, Ming-Fa Chen | 2006-04-11 |