Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9397080 | Package on package devices and methods of packaging semiconductor dies | Yu-Feng Chen, Ming-Che Ho, De-Yuan Lu, Chung-Shi Liu | 2016-07-19 |
| 9257401 | Method of fabricating bump structure and bump structure | Ming-Che Ho, Ming-Da Cheng, Chung-Shi Liu | 2016-02-09 |
| 8993431 | Method of fabricating bump structure | Ming-Che Ho, Ming-Da Cheng, Chung-Shi Liu | 2015-03-31 |
| 8981559 | Package on package devices and methods of packaging semiconductor dies | Chung-Shi Liu, De-Yuan Lu, Ming-Che Ho, Yu-Feng Chen | 2015-03-17 |